Process and characterization of (Pb, La)TiO3 thin films deposited by MOCVD for gigabit DRAM application

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dc.contributor.authorLee, SSko
dc.contributor.authorKang, YMko
dc.contributor.authorLee, Jko
dc.contributor.authorLee, DHko
dc.contributor.authorKim, Ho Giko
dc.date.accessioned2013-03-03T09:47:57Z-
dc.date.available2013-03-03T09:47:57Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued1998-12-
dc.identifier.citationJOURNAL DE PHYSIQUE IV, v.8, no.p9, pp.269-
dc.identifier.issn1155-4339-
dc.identifier.urihttp://hdl.handle.net/10203/78262-
dc.description.abstractLa-modified lead titanate. (Pb, La)TiO3. [PLT], thin films were deposited by low pressure metal organic chemical vapor deposition (MOCVD) on Pt/SiO2/Si substrates. The composition of the films was studied with various deposition conditions. Also, the electrical properties. such as the dielectric constant, the P-E hysteresis curve, and the leakage current density, were investigated with various annealing conditions. The experimental results show that the 180nm-thick PLT films with the La mole % of 12 are applicable as the planar capacitor layer of 1 gigabit DRAM.-
dc.languageEnglish-
dc.publisherE D P SCIENCES-
dc.titleProcess and characterization of (Pb, La)TiO3 thin films deposited by MOCVD for gigabit DRAM application-
dc.typeArticle-
dc.identifier.wosid000078118100054-
dc.identifier.scopusid2-s2.0-11744325592-
dc.type.rimsART-
dc.citation.volume8-
dc.citation.issuep9-
dc.citation.beginningpage269-
dc.citation.publicationnameJOURNAL DE PHYSIQUE IV-
dc.identifier.doi10.1051/jp4:1998953-
dc.contributor.localauthorKim, Ho Gi-
dc.contributor.nonIdAuthorLee, SS-
dc.contributor.nonIdAuthorKang, YM-
dc.contributor.nonIdAuthorLee, J-
dc.contributor.nonIdAuthorLee, DH-
dc.type.journalArticleArticle; Proceedings Paper-
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MS-Journal Papers(저널논문)
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