Adhesion strength of leadframe/EMC interfaces

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dc.contributor.authorLee, HYko
dc.contributor.authorYu, Jinko
dc.date.accessioned2013-03-03T05:50:16Z-
dc.date.available2013-03-03T05:50:16Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued1999-12-
dc.identifier.citationJOURNAL OF ELECTRONIC MATERIALS, v.28, no.12, pp.1444 - 1447-
dc.identifier.issn0361-5235-
dc.identifier.urihttp://hdl.handle.net/10203/77497-
dc.description.abstractCu-based leadframe sheets were oxidized in alkaline solutions to produce brown and/or black oxide on the surfaces, and molded with epoxy molding compound (EMC). The adhesion strength of leadframe/EMC interface was measured using sandwiched double-cantilever beam (SDCB) specimens and pull-out specimens. Results showed that the adhesion strength of leadframe/EMC interface was inherently very poor but could be increased drastically with the nucleation of acicular CuO precipitates. The presence of smooth-faceted Cu(2)O on the surface of the leadframe gave close to zero fracture toughness (G(C)) and suitable pull strength (PS). A direct correlation between G(C) and PS showed that PS can be a measure of G(C) only in a limited range.-
dc.languageEnglish-
dc.publisherSPRINGER-
dc.subjectCOPPER-
dc.subjectIMPROVEMENT-
dc.subjectTOUGHNESS-
dc.titleAdhesion strength of leadframe/EMC interfaces-
dc.typeArticle-
dc.identifier.wosid000084449600023-
dc.identifier.scopusid2-s2.0-0033281288-
dc.type.rimsART-
dc.citation.volume28-
dc.citation.issue12-
dc.citation.beginningpage1444-
dc.citation.endingpage1447-
dc.citation.publicationnameJOURNAL OF ELECTRONIC MATERIALS-
dc.identifier.doi10.1007/s11664-999-0138-3-
dc.contributor.localauthorYu, Jin-
dc.contributor.nonIdAuthorLee, HY-
dc.type.journalArticleArticle; Proceedings Paper-
dc.subject.keywordAuthorCu-based leadframe-
dc.subject.keywordAuthorEMC-
dc.subject.keywordAuthoradhesion strength-
dc.subject.keywordAuthorinterfacial fracture toughness-
dc.subject.keywordAuthorpull strength-
dc.subject.keywordPlusCOPPER-
dc.subject.keywordPlusIMPROVEMENT-
dc.subject.keywordPlusTOUGHNESS-
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