DC Field | Value | Language |
---|---|---|
dc.contributor.author | Ahn, EC | ko |
dc.contributor.author | Yu, Jin | ko |
dc.contributor.author | Park, IS | ko |
dc.date.accessioned | 2013-03-03T05:42:56Z | - |
dc.date.available | 2013-03-03T05:42:56Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1996-06 | - |
dc.identifier.citation | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.7, no.3, pp.175 - 179 | - |
dc.identifier.issn | 0957-4522 | - |
dc.identifier.uri | http://hdl.handle.net/10203/77478 | - |
dc.description.abstract | A single layer of CuCr alloy was sputter deposited on polyimide films instead of Cu/Cr double layers. The adhesion strengths of the metal/polyimide thin films were measured by the peel test. In order to study the effects of temperature and humidity on the adhesion strength, 85 degrees C/85% R.H. (T/H) treatments were applied to the specimens. Results showed that the peel strength without T/H treatments increased proportionally with the Cr content in the CuCr alloy layer (x) up to 17 at %, and then saturated. Among the samples studied, the peel strength decreased with hold time under T/H conditions for all the cases, but most drastically for the sample with x = 8.5. The very poor peel strength of that sample (x = 8.5) was attributed to the occurrence of interfacial failures, which were thought to take place along CuCr oxide/polyimide interfaces. | - |
dc.language | English | - |
dc.publisher | CHAPMAN HALL LTD | - |
dc.subject | ADHESION | - |
dc.title | Effects of temperature/humidity treatments on the peel strength of CuCr alloy films on polyimide | - |
dc.type | Article | - |
dc.identifier.wosid | A1996UT35300005 | - |
dc.identifier.scopusid | 2-s2.0-0030173636 | - |
dc.type.rims | ART | - |
dc.citation.volume | 7 | - |
dc.citation.issue | 3 | - |
dc.citation.beginningpage | 175 | - |
dc.citation.endingpage | 179 | - |
dc.citation.publicationname | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.contributor.nonIdAuthor | Ahn, EC | - |
dc.contributor.nonIdAuthor | Park, IS | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | ADHESION | - |
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