Microstructures and Properties of the Mechanically Alloyed Intermetallic-Dispersion-Strengthened Al Alloys기계적 합금화 방법으로 제조한 금속간화합물 분산강화 Al 합금의 미세구조와 특성

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dc.contributor.authorHan, SJko
dc.contributor.authorPark, SIko
dc.contributor.authorKin, JGko
dc.contributor.authorKim, SJko
dc.contributor.authorLee, HyuckMoko
dc.date.accessioned2013-03-03T05:33:09Z-
dc.date.available2013-03-03T05:33:09Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued1997-12-
dc.identifier.citationJOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.35, no.12, pp.1754 - 1762-
dc.identifier.issn1738-8228-
dc.identifier.urihttp://hdl.handle.net/10203/77452-
dc.description.abstractThe mechanical alloying process has been used to produce intermetallic-dispersion-strengthened Al alloys. While the mixing of elemental powders precedes the milling operation in a conventional mechanical alloying method, the mixing method of pre-fabricated intermetallic powders with AI powders has been suggested in this study. Dispersoid intermetallic powders have been made by pulverizing as-arc-melted tetragonal DO_(22)-, DO_(23)-structured A₃(Ti,V,Zr) and cubic Ll₂-structured Al_(66)Mn_9(Ti,Zr)_(25), monolithic compounds. Intermetallic dispersoids in Al alloys found to be stable after the heat-treatment at 425℃ up to 400 hours and overall, specimens maintained original microstructures with a fine distribution of intermetallic compounds. Due to the fine and stable dispersion, alloys showed high compressive yield stress levels at room and elevated temperatures.-
dc.languageEnglish-
dc.publisherKOREAN INST METALS MATERIALS-
dc.titleMicrostructures and Properties of the Mechanically Alloyed Intermetallic-Dispersion-Strengthened Al Alloys-
dc.title.alternative기계적 합금화 방법으로 제조한 금속간화합물 분산강화 Al 합금의 미세구조와 특성-
dc.typeArticle-
dc.type.rimsART-
dc.citation.volume35-
dc.citation.issue12-
dc.citation.beginningpage1754-
dc.citation.endingpage1762-
dc.citation.publicationnameJOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS-
dc.contributor.localauthorLee, HyuckMo-
dc.contributor.nonIdAuthorHan, SJ-
dc.contributor.nonIdAuthorPark, SI-
dc.contributor.nonIdAuthorKin, JG-
dc.contributor.nonIdAuthorKim, SJ-
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