This paper describes a 32-bank 1 Gb DRAM achieving 1 Gbyte/s (500 Mb/s/DQ pin) data bandwidth and the access time from RAS of 31 ns at V-cc = 2.0 V and 25 degrees C, The chip employs 1) a merged multibank architecture to minimize die area; 2) an extended small swing read operation and a single I/O line driving write scheme to reduce power consumption; 3) a self-strobing I/O schemes to achieve high bandwidth with low power dissipation; and 4) a block redundancy scheme with increased flexibility, The nonstitched chip with an area of 652 mm(2) has been fabricated using 0.16 mu m four-poly, four-metal CMOS process technology.