Highly Reliable Polysilicon Oxide Grown by Electron Cyclotron Resonance Nitrous Oxide Plasma

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dc.contributor.authorNae-In Leeko
dc.contributor.authorJin-Woo Leeko
dc.contributor.authorSung-Hoi Hurko
dc.contributor.authorHyung-Sub Kimko
dc.contributor.authorChul-Hi Hanko
dc.date.accessioned2013-02-28T04:39:33Z-
dc.date.available2013-02-28T04:39:33Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued1997-10-
dc.identifier.citationIEEE ELECTRON DEVICE LETTERS, v.18, no.10, pp.486 - 488-
dc.identifier.issn0741-3106-
dc.identifier.urihttp://hdl.handle.net/10203/72815-
dc.description.abstractHighly reliable inter-polysilicon oxide (polyoxide) for nonvolatile memory applications has been achieved using electron cyclotron resonance (ECR) N2O-plasma, It is demonstrated that the N2O-plasma polyoxide grown on doped poly-Si has a low leakage current and high breakdown field due to a smooth polyoxide/poly-Si interface and nitrogen incorporation during oxidation, Moreover, the polyoxide has much less electron trapping and over one order larger charge-to-breakdown (Q(bd)) up to 10 C/cm(2) than thermal polyoxide. The N2O-plasma polyoxide can be a good choice for interpoly dielectric of nonvolatile memories.-
dc.languageEnglish-
dc.publisherIEEE-Inst Electrical Electronics Engineers Inc-
dc.subjectPERFORMANCE-
dc.titleHighly Reliable Polysilicon Oxide Grown by Electron Cyclotron Resonance Nitrous Oxide Plasma-
dc.typeArticle-
dc.identifier.wosidA1997XX23700008-
dc.identifier.scopusid2-s2.0-0031257842-
dc.type.rimsART-
dc.citation.volume18-
dc.citation.issue10-
dc.citation.beginningpage486-
dc.citation.endingpage488-
dc.citation.publicationnameIEEE ELECTRON DEVICE LETTERS-
dc.contributor.localauthorChul-Hi Han-
dc.contributor.nonIdAuthorNae-In Lee-
dc.contributor.nonIdAuthorJin-Woo Lee-
dc.contributor.nonIdAuthorSung-Hoi Hur-
dc.contributor.nonIdAuthorHyung-Sub Kim-
dc.type.journalArticleArticle-
dc.subject.keywordPlusPERFORMANCE-
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