DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yoon, SW | ko |
dc.contributor.author | Choi, WK | ko |
dc.contributor.author | Lee, HyuckMo | ko |
dc.date.accessioned | 2013-02-27T22:25:21Z | - |
dc.date.available | 2013-02-27T22:25:21Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1999 | - |
dc.identifier.citation | SCRIPTA MATERIALIA, v.40, no.3, pp.327 - 332 | - |
dc.identifier.issn | 1359-6462 | - |
dc.identifier.uri | http://hdl.handle.net/10203/71194 | - |
dc.language | English | - |
dc.publisher | Pergamon-Elsevier Science Ltd | - |
dc.subject | SN | - |
dc.subject | DIFFUSION | - |
dc.subject | SYSTEM | - |
dc.subject | ALLOYS | - |
dc.subject | JOINTS | - |
dc.subject | COPPER | - |
dc.title | Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrate | - |
dc.type | Article | - |
dc.identifier.wosid | 000078767700010 | - |
dc.identifier.scopusid | 2-s2.0-0033534274 | - |
dc.type.rims | ART | - |
dc.citation.volume | 40 | - |
dc.citation.issue | 3 | - |
dc.citation.beginningpage | 327 | - |
dc.citation.endingpage | 332 | - |
dc.citation.publicationname | SCRIPTA MATERIALIA | - |
dc.contributor.localauthor | Lee, HyuckMo | - |
dc.contributor.nonIdAuthor | Yoon, SW | - |
dc.contributor.nonIdAuthor | Choi, WK | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | SN | - |
dc.subject.keywordPlus | DIFFUSION | - |
dc.subject.keywordPlus | SYSTEM | - |
dc.subject.keywordPlus | ALLOYS | - |
dc.subject.keywordPlus | JOINTS | - |
dc.subject.keywordPlus | COPPER | - |
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