Improved Copper chemical vapor deposition process by applying substrate bias
- Publisher
- Wiley-Blackwell
- Issue Date
- 1996
- Language
- English
- Citation
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.427, pp.207 - 212
- ISSN
- 0002-7820
- Appears in Collection
- RIMS Journal Papers
- Files in This Item
- There are no files associated with this item.
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