Improved Copper chemical vapor deposition process by applying substrate bias

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Publisher
Wiley-Blackwell
Issue Date
1996
Language
English
Citation

JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.427, pp.207 - 212

ISSN
0002-7820
URI
http://hdl.handle.net/10203/70638
Appears in Collection
RIMS Journal Papers
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