DC Field | Value | Language |
---|---|---|
dc.contributor.author | 백경욱 | ko |
dc.date.accessioned | 2013-02-27T19:53:50Z | - |
dc.date.available | 2013-02-27T19:53:50Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1996-10 | - |
dc.identifier.citation | 대한기계학회저널, v.36, no.10, pp.947 - 954 | - |
dc.identifier.issn | 1225-5955 | - |
dc.identifier.uri | http://hdl.handle.net/10203/70500 | - |
dc.language | Korean | - |
dc.publisher | 대한기계학회지 | - |
dc.title | 멀티칩 모듈 기술 | - |
dc.title.alternative | Multichip Module(MCM) Technoology | - |
dc.type | Article | - |
dc.type.rims | ART | - |
dc.citation.volume | 36 | - |
dc.citation.issue | 10 | - |
dc.citation.beginningpage | 947 | - |
dc.citation.endingpage | 954 | - |
dc.citation.publicationname | 대한기계학회저널 | - |
dc.contributor.localauthor | 백경욱 | - |
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