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Showing results 1 to 4 of 4

1
Chip warpage damage model for ACA film type electronic packages

Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005

2
Measuring and compensating for 5-DOF parasitic motion errors in translation stages using Twyman-Green interferometry

Oh, Jeong Seok; Bae, Eun Deok; Keem, Taeho; Kim, Seung-Woo, INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, v.46, no.14, pp.1748 - 1752, 2006-11

3
간섭원리를 이용한 이송축의 진직 운동 정확도 측정 = Measurement of moving accuracy of a precision machine axis with laser interferometrylink

임노빈; Yim, Noh-Bin; et al, 한국과학기술원, 2000

4
확장 트와이만-그린 간섭계를 이용한 직선 운동 오차의 실시간 보상 = Real-time compensation of motion errors using extended twyman-green interferometrylink

배은덕; Bae, Eun-Deok; et al, 한국과학기술원, 2003

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