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1
(A) study on the characteristics of TaN films deposited by ALD using hydrogen plasma = 수소 플라즈마를 이용한 ALD 법으로 증착된 TaN 박막 특성에 관한 연구link

Lee, Min-Jung; 이민정; et al, 한국과학기술원, 2001

2
Cu 확산방지용 TCP MOCVD Ta(Si)N 박막 증착 및 특성에 관한 연구 = Deposition and characterization of TCP MOCVD Ta(Si)N thin films as diffusion barrier for Culink

박혜련; Park, Hye-Lyun; et al, 한국과학기술원, 2002

3
Silicide Formation Process of Er Films with Ta and TaN Capping Layers

Choi, Juyun; Choi, Seongheum; Kim, Jungwoo; Na, Sekwon; Lee, Jeong-Hoo; Lee, Seok-Hee; Kim, Hyoungsub, ACS APPLIED MATERIALS & INTERFACES, v.5, no.23, pp.12744 - 12750, 2013-12

4
Transformer coupled plasma enhanced metal organic chemical vapor deposition of Ta(Si)N thin films and their Cu diffusion barrier properties

Park, HL; Byun, KM; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.41, no.10, pp.6153 - 6164, 2002-10

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