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Improved Copper Chemical Vapor Deposition Process by Applying Substrate Bias Park, Chong-Ook; Lee, Won-Jun; Rha, Sa-Kyun; Lee, Seung-Yun; Kim, Dong-Won; Chun, Soung-Soon, 1996 MRS Spring Symposium, v.427, pp.207 - 212, 1996-04-08 |
The electrical properties of dielectric stacks of SiO2 and Al2O3 prepared by atomic layer deposition method Han, Byeol; Lee, Seung-Won; Park, Kwangchol; Park, Chong-Ook; Rha, Sa-Kyun; Lee, Won-Jun, CURRENT APPLIED PHYSICS, v.12, no.2, pp.434 - 436, 2012-03 |
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