Improved Copper Chemical Vapor Deposition Process by Applying Substrate Bias

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Issue Date
1996-04-08
Language
ENG
Citation

1996 MRS Spring Symposium, v.427, pp.207 - 212

ISSN
0272-9172
URI
http://hdl.handle.net/10203/123993
Appears in Collection
MS-Conference Papers(학술회의논문)
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