Browse "College of Engineering(공과대학)" by Title
Showing results 40861 to 40880 of 203541
| CURE ANALYSIS OF SHEET MOLDING COMPOUND IN MOLDS WITH SUBSTRUCTURES FAN, JD; LEE, LJ; KIM, J; Im, Yong-Taek, POLYMER ENGINEERING AND SCIENCE, v.29, no.11, pp.740 - 748, 1989-06 |
| Cure behaviors of vinyl ester resins with low profile thermoplastic additives and thermoplastic elastomers = 수축 억제용 열가소성 수지 및 열가소성 탄성체가 첨가된 열결화성 비닐 에스테르 수지의 경화 거동link Hong, Myung-Sun; 홍명선; et al, 한국과학기술원, 1991 |
| Cure cycle for thick glass/epoxy composite laminates Oh, JH; Lee, Dai Gil, JOURNAL OF COMPOSITE MATERIALS, v.36, no.1, pp.19 - 45, 2002 |
| Cure monitoring of composite laminate using a fiber Bragg grating sensor Yoon, HJ; Kim, Chun-Gon, KAIST/Doshisha Univ./Nihon Univ. Joint Workshop on Composite materials 2005, Korea Advanced Institute of Science and Technology, 2005-03-29 |
| Cure Monitoring of Composite Laminates Using Fiber Optic Sensors 강현규; 강동훈; 박형준; 홍창선; 김천곤; 방형준, 복합재료학회 한일 조인트 세션, pp.179 - 184, 복합재료학회, 2001-10 |
| Cure Monitoring of Composite Laminates Using Fiber Optic Sensors Kang, Hyun-Kyu; Kang, Dong-Hoon; Bang, Hyung-Joon; Hong, Chang-Sun; Kim, Chun-Gon, Smart Materials and Structures, v.11 no.2, pp.279-287, 2002 |
| Cure monitoring of composite laminates using fiber optic sensors Kang, HK; Kang, DH; Bang, HJ; Hong, Chang Sun; Kim, Chun-Gon, SMART MATERIALS & STRUCTURES, v.11, no.2, pp.279 - 287, 2002-04 |
| Cure Monitoring of Composite Laminates Using Fiber Optic Sensors Kang, H. K.; Kang, D. H.; Bang, H. J.; Hong, C. S.; Kim, C. G., Smart Materials and Structures, Vol.11, No.2, pp.279-287, 2002 |
| Cure Monitoring of Thermosetting Resin Composites by Lacomtech Dielectrometry Kwon, JW; Lee, Dai Gil, International Conference on Composite Materials, 2001 |
| Cure monitoring using long pulse and high power laser Truong, Thanh Chung; Ahmed, Hassan; 이정률, 2017년도 항공우주학회 추계학술대회, 한국항공우주학회, 2017-11 |
| Cured Shape of Unsymmetric Laminates with Arbitrary Lay-Up Angles Jun, W. J.; Hong, Chang Sun, JOURNAL OF REINFORCED PLASTICS AND COMPOSITES, v.11, no.12, pp.1352 - 1366, 1992-12 |
| Curing and bonding behaviors of Anisotropic Conductive Films (ACFs) by ultrasonic vibration for flip chip interconnection Lee, KW; Kim, HJ; Yim, MJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.918 - 923, IEEE, 2006-05-30 |
| Curing and phase separation behavior of amine terminated butadiene acrylonitrile copolymer(ATBN) modified epoxy Kim, D. S.; Kim, Sung Chul, POLYMERS FOR ADVANCED TECHNOLOGIES, v.1, no.3-4, pp.211 - 217, 1990-02 |
| Curing and Phase Separation Behavior of ATBN Modified Epoxy 김성철, 한국복합재료학회 춘계학술발표회, pp.20 -, 1989 |
| Curing and phase separation behavior of epoxy resin modified with ATBN = ATBN이 첨가된 에폭시 수지의 경화 및 상분리 현상에 관한 연구link Kim, Dae-Su; 김대수; et al, 한국과학기술원, 1989 |
| Curing and Phase Separation in Rubber-Modified Epoxy 김성철, 한국고분자학회 추계학술발표회, pp.20 -, 1990 |
| Curing behaviour and mechanical property of unsaturated polyester based on recycled PET = PET를 재생하여 만든 불포화 폴리에스터의 경화거동 및 물성에 관한 연구link Suh, Duck-Jong; 서덕종; Yang, Seung-Man; Park, O-Ok; et al, 한국과학기술원, 1998 |
| Curing characteristics of polyimide on temperatures Kim, SM; Koo, YM; Kim, Jong-Duk, 한국화학공학회 춘계학술발표회, pp.0 - 0, 한국화학공학회, 1994-04-29 |
| Curing characteristics of polyimides on temperatures Kim, SM; Koo, YM; Kim, Jong-Duk, 1994 한국고분자학회 춘계학술발표회, pp.0 - 0, 한국고분자학회, 1994-04-16 |
| Curing of 1-Transistor-DRAM by Joule Heat From Punch-Through Current Kim, Hyun-Jung; Lee, Geon-Beom; Han, Joon-Kyu; Han, Seong-Joo; Kim, Da-Jin; Yu, Ji-Man; Kim, Myung-Su; et al, IEEE ELECTRON DEVICE LETTERS, v.43, no.3, pp.370 - 373, 2022-03 |
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