Sn-Bi 합금도금층의 미세조직에 미치는 도금변수의 영향 및 Sn-Bi/Cu 계면에서의 금속간 화합물의 성장Effects of plating Parameters on the Microstructure of 80Sn-20Pb Electrodeposits from an Organic Sulfonate Bath

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dc.contributor.author서민석ko
dc.contributor.author박찬진ko
dc.contributor.author권혁상ko
dc.date.accessioned2013-02-27T08:21:12Z-
dc.date.available2013-02-27T08:21:12Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued1994-01-
dc.identifier.citationCORROSION SCIENCE AND TECHNOLOGY, v.23, pp.11 - 22-
dc.identifier.issn1598-6462-
dc.identifier.urihttp://hdl.handle.net/10203/67446-
dc.languageKorean-
dc.publisher한국부식방식학회-
dc.titleSn-Bi 합금도금층의 미세조직에 미치는 도금변수의 영향 및 Sn-Bi/Cu 계면에서의 금속간 화합물의 성장-
dc.title.alternativeEffects of plating Parameters on the Microstructure of 80Sn-20Pb Electrodeposits from an Organic Sulfonate Bath-
dc.typeArticle-
dc.type.rimsART-
dc.citation.volume23-
dc.citation.beginningpage11-
dc.citation.endingpage22-
dc.citation.publicationnameCORROSION SCIENCE AND TECHNOLOGY-
dc.contributor.localauthor권혁상-
dc.contributor.nonIdAuthor서민석-
dc.contributor.nonIdAuthor박찬진-
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MS-Journal Papers(저널논문)
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