ADHESION ENHANCEMENT OF THIN COPPER FILM ON POLYIMIDE MODIFIED BY OXYGEN REACTIVE ION-BEAM ETCHING
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.contributor.author | Ruoff, AL | ko |
| dc.date.accessioned | 2013-02-27T03:29:02Z | - |
| dc.date.available | 2013-02-27T03:29:02Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1990 | - |
| dc.identifier.citation | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.4, no.1, pp.465 - 474 | - |
| dc.identifier.issn | 0169-4243 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/66188 | - |
| dc.language | English | - |
| dc.publisher | VSP BV | - |
| dc.title | ADHESION ENHANCEMENT OF THIN COPPER FILM ON POLYIMIDE MODIFIED BY OXYGEN REACTIVE ION-BEAM ETCHING | - |
| dc.type | Article | - |
| dc.identifier.wosid | A1990DV64000003 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 4 | - |
| dc.citation.issue | 1 | - |
| dc.citation.beginningpage | 465 | - |
| dc.citation.endingpage | 474 | - |
| dc.citation.publicationname | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | - |
| dc.identifier.doi | 10.1163/156856190X00432 | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Ruoff, AL | - |
| dc.type.journalArticle | Article | - |
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