ADHESION ENHANCEMENT OF POLYIMIDE ON COPPER BY AR ION-BEAM ETCHING OF COPPER
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.contributor.author | Ruoff, AL | ko |
| dc.date.accessioned | 2013-02-25T23:40:48Z | - |
| dc.date.available | 2013-02-25T23:40:48Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1988 | - |
| dc.identifier.citation | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.2, no.1, pp.245 - 253 | - |
| dc.identifier.issn | 0169-4243 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/66065 | - |
| dc.language | English | - |
| dc.publisher | VSP BV | - |
| dc.title | ADHESION ENHANCEMENT OF POLYIMIDE ON COPPER BY AR ION-BEAM ETCHING OF COPPER | - |
| dc.type | Article | - |
| dc.identifier.wosid | A1988P725200001 | - |
| dc.identifier.scopusid | 2-s2.0-0004920488 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 2 | - |
| dc.citation.issue | 1 | - |
| dc.citation.beginningpage | 245 | - |
| dc.citation.endingpage | 253 | - |
| dc.citation.publicationname | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | - |
| dc.identifier.doi | 10.1163/156856188X00255 | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Ruoff, AL | - |
| dc.description.isOpenAccess | N | - |
| dc.type.journalArticle | Article | - |
- Appears in Collection
- MS-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
This item is cited by other documents in WoS
| ⊙ Detail Information in WoSⓡ | Click to see |  |
| ⊙ Cited 10 items in WoS | Click to see citing articles in |  |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.