DC Field | Value | Language |
---|---|---|
dc.contributor.author | Y.S. Chung | ko |
dc.contributor.author | Kim, Ho Gi | ko |
dc.date.accessioned | 2013-02-25T20:53:39Z | - |
dc.date.available | 2013-02-25T20:53:39Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1988-06 | - |
dc.identifier.citation | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.2, pp.195 - 199 | - |
dc.identifier.issn | 2156-3950 | - |
dc.identifier.uri | http://hdl.handle.net/10203/65187 | - |
dc.language | English | - |
dc.publisher | IEEE-Inst Electrical Electronics Engineers Inc | - |
dc.title | Effect of Oxide Glass on the Sintering Behavior and Electrical Properties in Ag Thick Films | - |
dc.type | Article | - |
dc.identifier.wosid | A1988N272500004 | - |
dc.identifier.scopusid | 2-s2.0-0024034428 | - |
dc.type.rims | ART | - |
dc.citation.volume | 11 | - |
dc.citation.issue | 2 | - |
dc.citation.beginningpage | 195 | - |
dc.citation.endingpage | 199 | - |
dc.citation.publicationname | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | - |
dc.contributor.localauthor | Kim, Ho Gi | - |
dc.contributor.nonIdAuthor | Y.S. Chung | - |
dc.type.journalArticle | Article | - |
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