Dynamic Dielectric Analysis During Cure Process of the Glass / Epoxy Composite Leaf SpringComposite 판스프링 제작시의 동적유전성분석
- Publisher
- 한국복합재료학회
- Issue Date
- 1991-12
- Language
- Korean
- Citation
한국복합재료학회지, v.4, no.2, pp.30 - 37
- ISSN
- 1598-6934
- Appears in Collection
- Files in This Item
- There are no files associated with this item.
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