Dynamic Dielectric Analysis During Cure Process of the Glass / Epoxy Composite Leaf SpringComposite 판스프링 제작시의 동적유전성분석
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김호철 | ko |
| dc.date.accessioned | 2013-02-25T18:31:11Z | - |
| dc.date.available | 2013-02-25T18:31:11Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1991-12 | - |
| dc.identifier.citation | 한국복합재료학회지, v.4, no.2, pp.30 - 37 | - |
| dc.identifier.issn | 1598-6934 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/64336 | - |
| dc.language | Korean | - |
| dc.publisher | 한국복합재료학회 | - |
| dc.title | Dynamic Dielectric Analysis During Cure Process of the Glass / Epoxy Composite Leaf Spring | - |
| dc.title.alternative | Composite 판스프링 제작시의 동적유전성분석 | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 4 | - |
| dc.citation.issue | 2 | - |
| dc.citation.beginningpage | 30 | - |
| dc.citation.endingpage | 37 | - |
| dc.citation.publicationname | 한국복합재료학회지 | - |
- Appears in Collection
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.