Browse "ME-Journal Papers(저널논문)" by Subject Warpage
Showing results 1 to 5 of 5
| Enhancing predictability of thermal warpage by applying temperature-dependent Poisson's ratio of epoxy molding compound Kim, Junmo; Song, Myoung; Gu, Chang-Yeon; Ma, Sungwoo; Lee, Jin Hee; Lee, Woong-Sun; Kim, Taek-Soo, POLYMER TESTING, v.125, 2023-08 |
| The measurement of residual deformation in PBGA package after reflow process using a newly developed laser profiler Kim, I.; Yoon, J.Y.; Lee, Soon-Bok, KEY ENGINEERING MATERIALS, v.326-328 I, no.0, pp.513 - 516, 2006 |
| 잔류응력으로 인한 패키지 기판 굽힘 변형량 예측 김철규; 최혜선; 김민성; 김택수, 마이크로전자 및 패키징학회지, v.20, no.1, pp.21 - 26, 2013-03 |
| 초박형 반도체 패키지의 EMC encapsulation을 위한 경화 공정 개발 Park, Seong Yeon; On, Seung Yoon; Kim, Seong Su, COMPOSITES RESEARCH, v.34, no.1, pp.47 - 50, 2021-02 |
휨을 고려한 칩 패키지의 EMC/PCB 계면 접합 에너지 측정 김형준; 안광호; 오승진; 김도한; 김재성; 김은숙; 김택수, 마이크로전자 및 패키징학회지, v.26, no.4, pp.101 - 105, 2019-12 |
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