초박형 반도체 패키지의 EMC encapsulation을 위한 경화 공정 개발Development of Curing Process for EMC Encapsulation of Ultra-thin Semiconductor Package

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In this paper, the Curing process for Epoxy Molding Compound (EMC) Package was developed by comparing the performance of the EMC/Cu Bi-layer package manufactured by the conventional Hot Press process system and Carbon Nanotubes (CNT) Heater process system of the surface heating system. The viscosity of EMC was measured by using a rheometer for the curing cycle of the CNT Heater. In the EMC/Cu Bi-layer Package manufactured through the two process methods by mentioned above, the voids inside the EMC was analyzed using an optical microscope. In addition, the interfacial void and warpage of the EMC/Cu Bi-layer Package were analyzed through C-Scanning Acoustic Microscope and 3D-Digital Image Correlation. According to these experimental results, it was confirmed that there was neither void in the EMC interior nor difference in the warpage at room temperature, the zero-warpage temperature and the change in warpage.
Publisher
KOREAN SOC COMPOSITE MATERIALS
Issue Date
2021-02
Language
Korean
Article Type
Article
Citation

COMPOSITES RESEARCH, v.34, no.1, pp.47 - 50

ISSN
2288-2103
DOI
10.7234/composres.2021.34.1.047
URI
http://hdl.handle.net/10203/282330
Appears in Collection
ME-Journal Papers(저널논문)
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