Browse "ME-Journal Papers(저널논문)" by Author Yoo, Choong-Don
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| Design of Highly Uniform Spool and Bar Horns for Ultrasonic Bonding Kim, Sun-Rak; Lee, Jae-Hak; Yoo, Choong-Don; Song, Jun-Yeob; Lee, Seung-Seob, IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, v.58, no.10, pp.2194 - 2201, 2011-10 |
| Development of Inclined Conductive Bump for Flip-Chip Interconnection Park, Ah-Young; Park, Seungbae; Yoo, Choong-Don, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.2, pp.207 - 216, 2015-02 |
| Dynamic force balance model for metal transfer analysis in arc welding Choi, JH; Lee, J; Yoo, Choong-Don, Journal of Physics D: Applied Physics, v.34, no.17, pp.2658 - 2664, 2001-09 |
| Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics Jo, Jung-Lae; Lee, Jong-Bum; Lee, Jong-Gun; Jeon, Sung-Ho; Kim, Jong-Min; Shin, Young-Eui; Moon, Jeong-Hoon; et al, JAPANESE JOURNAL OF APPLIED PHYSICS, v.48, no.7, pp.07GA01 - 07GA04, 2009-07 |
| Effects of surface depression on pool convection and geometry in stationary GTAW Ko, SH; Choi, SK; Yoo, Choong-Don, Welding Journal, v.80, no.2, pp.39S - 0, 2001-02 |
| Efficient Wafer-Level Edge-Tracing Technique for 3-D Interconnection of Stacked Die Kim, Sun-Rak; Lee, Phil-Lip; Lee, Jae-Hak; Song, Jun-Yeob; Yoo, Choong-Don; Lee, Seung-Seob, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.6, pp.1048 - 1054, 2012-06 |
| Investigation on arc light intensity in gas metal arc welding Part 1: relationship between arc light intensity and arc length Yoo, Choong-Don; Yoo, YS; Sunwoo, HK, PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS. PART B. MANAGEMENT AND ENGINEERING MANUFACTURE, v.211, no.5, pp.345 - 354, 1997 |
| Mechanism of keyhole formation and stability in stationary laser welding Lee, Jae Y; Ko, Sung H; Farson, Dave F Fason; Yoo, Choong-Don, Journal of Physics D: Applied Physics, v.0, no.0, pp.0 - 0, 2002-06 |
| Prediction of three-dimensional solder joint profile in gullwing leads Yoo, Choong-Don; Choi, Tong P.; Lee, Tae S., INTERNATIONAL JOURNAL OF MICROCIRCUITS AND ELECTRONIC PACKAGING, v.21, no.2, pp.162 - 170, 1998 |
| Simulation of dynamic behavior in a GMAW system Choi, JH; Lee, JY; Yoo, Choong-Don, Welding Journal, v.80, no.10, pp.239S - 245S, 2001-10 |
| Soldering method using longitudinal ultrasonic Kim, Jung Ho; Lee, J; Yoo, Choong-Don, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.28, no.3, pp.493 - 498, 2005-09 |
| Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding Lee, JY; Kim, JH; Yoo, Choong-Don, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.1, pp.96 - 102, 2005-01 |
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