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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Journal Papers(저널논문)

Prediction of three-dimensional solder joint profile in gullwing leads

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Yoo, Choong-Don researcher / Choi, Tong P. / Lee, Tae S.

Publisher: International Microelectronics And Packaging Society

Issue Date: 1998

Language: English

Citation: INTERNATIONAL JOURNAL OF MICROCIRCUITS AND ELECTRONIC PACKAGING, v.21, no.2, pp.162 - 170

ISSN: 1063-1674

URI: http://hdl.handle.net/10203/73406

Appears in Collection: ME-Journal Papers(저널논문)

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