Browse "ME-Journal Papers(저널논문)" by Author Yang, Se Young
Showing results 1 to 3 of 3
| A study on the thermal fatigue behavior of solder joints under power cycling conditions Yang, Se Young; Kim, Ilho; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.1, pp.3 - 12, 2008-03 |
| Chip warpage model for reliability prediction of delamination failures Yang, Se Young; Kwon, Woon-Seong; Lee, Soon-Bok, MICROELECTRONICS RELIABILITY, v.52, no.4, pp.718 - 724, 2012-04 |
| Effects of Solder Alloys on Reliability of Low Cost Flip Chip Solder Joints using Electroless Ni-P UBMs Jeon, Young Doo; Yang, Se Young; Paik, KW; Lee, Soon-Bok, IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2006-12 |
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