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Showing results 1 to 5 of 5

1
Effect of High-Temperature Exposure on the Thermo-Mechanical Behavior of Epoxy Molding Compound and Warpage of Molded Wafers

Kim, Junmo; Song, Myoung; Gu, Chang-Yeon; Ju, Min Sang; Kim, Taek-Soo, 73rd IEEE Electronic Components and Technology Conference, ECTC 2023, IEEE, 2023-06-02

2
Elucidating Thickness-Dependent Plane Stress Fracture Toughness of Ultra-Thin Nanocrystalline Gold Films

Song, Myoung; Ma, Boo Soo; Oh, Seung Jin; Kim, Taek-Soo, ICEM20 - 20th International Conference on Experimental Mechanics, EuraSEM - European Society of Experimental Mechanics, 2023-07-06

3
Enhancing Predictability of Thermal Warpage of Molded Wafer by Applying Accurate Thermo-Mechanical Properties of Epoxy Molding Compound

Kim, Junmo; Song, Myoung; Gu, Chang-Yeon; Ma, Sung Woo; Jeong, Mu-Hyeon; Lee, Jin Hee; Lee, Woong-Sun; et al, The 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 2023, IEEE, 2023-03-08

4
Prediction of Wiggling Phenomenon in High Aspect Ratio Thin Film Structure During Etching Process through Buckling-Based Dimensional Analysis

Song, Myoung; Jang, Kyung-Lim; Jung, Narae; Kim, Sungjin; Kim, Dae Sin; Kim, Taek-Soo, The 21st International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2023-10-27

5
Thermo-Mechanical Behavior of Molded Underfill Filling the Sub-100μm Die Gap for Advanced Packaging

Ju, Min Sang; Kim, Junmo; Gu, Chang-Yeon; Song, Myoung; Ma, Sung Woo; Lee, Jin Hee; Lee, Woong-Sun; et al, The 21st International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2023-10-27

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