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Showing results 1 to 8 of 8

1
A flexure-guided scanner for an atomic force microscope: design and performance

Lee, DY; Lee, MY; Park, JH; Gweon Dae Gab, Nanoengineering Symposium 2005, pp.360 - 365, 2005-10-28

2
Effect of high glass transition temperature on reliability of Non-Conductive Film (NCF)

Park, JH; Chung, CK; Paik, KW; Lee, Soon-Bok, International Confernce on Experimental Mechanics, 2006, v.326-328 I, pp.517 - 520, 2006

3
Fracture toughness assessment of ACF flip-chip packages under high moisture condition with Moire interferometry

Park, JH; Jang, JW; Jang, KW; Paik, KW; Lee, Soon-Bok, 2009 European Microelectronics and Packaging Conference, EMPC 2009, EMPC, 2009-06-15

4
High resolution AFM Moire technique for the detection of defects in nano structure

Park, JH; Lee, Soon-Bok, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19

5
Novel micro-spiked needles with buried micro-channels for micro-scale biopsy

Byun, S; Lim, JM; Paik, SJ; Lee, A; Koo, KI; Park, S; Park, JH; et al, Asia-Pacific Conf. of Transducers and Micro-Nano Tech., 2004-07

6
Reliability evaluation for flip-chip electronic packages under high temperature and moisture condition using moire

Park, JH; Jang, KW; Paik, KW; Lee, Soon-Bok, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.633 - 638, 123, 2008-12-09

7
Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis

Son, HY; Paik, KW; Kim, I; Park, JH; Lee, Soon-Bok; Jung, GJ; Park, BJ; et al, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.716 - 724, 2008-12-09

8
Thermal Cycling Reliability Issue of Thick Cu Column Based Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates for Fine Pitch Applications

Lee, Soon-Bok; Son, HY; Kim, I; Park, JH; Jung, GJ; Park, BJ; Byun, KY; et al, EPTC 2008, 2008

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