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Showing results 1 to 6 of 6

1
Cure Monitoring of Thermosetting Resin Composites by Lacomtech Dielectrometry

Kwon, JW; Lee, Dai Gil, International Conference on Composite Materials, 2001

2
In-Situ Monitoring of Adhesively Bonded Joints by Dielectrometry

Kwon, JW; Lee, Dai Gil, International Symposium of Adhesive Joints Formation Characteristics and Testing, 2002-07

3
Modeling of Environmental Effects on the Strength of Adhesively Bonded Joints

Kwon, JW; Lee, Dai Gil, International Symposium of Adhesive Joints Formation Characteristics and Testing, 2000

4
Moisture Effects on Adhesively Bonded Tubular Single Lap Joints

Kwon, JW; Lee, Dai Gil, Adhesive Joints: Formation, Characterization and Testing, pp.369 - 384, Adhesive Joints, 2002-05

5
Peel Strength Improvement of Foam Core Sandwich Beams by Resin Impregnation on the Interfacial Surface

Lee, CS; Lim,TS; Kwon, JW; Lee, Dai Gil, International Symposium of Adhesive Joints Formation Characteristics and Testing, 2002-07

6
Trenchless Repairing of Underground Pipes using RTM and Dielectrometry

Chin, WS; Kwon, JW; Lee, Dai Gil, International Conference on Composites in Infra-Structures, 2002-07

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