Showing results 1 to 6 of 6
Cure Monitoring of Thermosetting Resin Composites by Lacomtech Dielectrometry Kwon, JW; Lee, Dai Gil, International Conference on Composite Materials, 2001 |
In-Situ Monitoring of Adhesively Bonded Joints by Dielectrometry Kwon, JW; Lee, Dai Gil, International Symposium of Adhesive Joints Formation Characteristics and Testing, 2002-07 |
Modeling of Environmental Effects on the Strength of Adhesively Bonded Joints Kwon, JW; Lee, Dai Gil, International Symposium of Adhesive Joints Formation Characteristics and Testing, 2000 |
Moisture Effects on Adhesively Bonded Tubular Single Lap Joints Kwon, JW; Lee, Dai Gil, Adhesive Joints: Formation, Characterization and Testing, pp.369 - 384, Adhesive Joints, 2002-05 |
Peel Strength Improvement of Foam Core Sandwich Beams by Resin Impregnation on the Interfacial Surface Lee, CS; Lim,TS; Kwon, JW; Lee, Dai Gil, International Symposium of Adhesive Joints Formation Characteristics and Testing, 2002-07 |
Trenchless Repairing of Underground Pipes using RTM and Dielectrometry Chin, WS; Kwon, JW; Lee, Dai Gil, International Conference on Composites in Infra-Structures, 2002-07 |
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