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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

In-Situ Monitoring of Adhesively Bonded Joints by Dielectrometry

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Kwon, JW / Lee, Dai Gilresearcher
Issue Date
2002-07
Language
ENG
Citation

International Symposium of Adhesive Joints Formation Characteristics and Testing

URI
http://hdl.handle.net/10203/135808
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ME-Conference Papers(학술회의논문)
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