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Showing results 1 to 6 of 6

1
Angstrom-accuracy multilayer thickness determination using optical metrology and machine learning

Kwak,Hyunsoo; Ryu,Sungyoon; Cho, Suil; Kim, Junmo; Yang, Yusin; Kim, Jungwon, Optical Measurement Systems for Industrial Inspection XII 2021, SPIE, 2021-06

2
Characterization of Metal Electrode Corrosion on Ionic Polymer

Kim, Junmo; Pyo, Jae-Bum; Kim, Taek-Soo, 2018 - Emerging Technologies in Mechanical Engineering, The Korean Society of Mechanical Engineers (KSME), 2018-08-21

3
Effect of High-Temperature Exposure on the Thermo-Mechanical Behavior of Epoxy Molding Compound and Warpage of Molded Wafers

Kim, Junmo; Song, Myoung; Gu, Chang-Yeon; Ju, Min Sang; Kim, Taek-Soo, 73rd IEEE Electronic Components and Technology Conference, ECTC 2023, IEEE, 2023-06-02

4
Enhancing Predictability of Thermal Warpage of Molded Wafer by Applying Accurate Thermo-Mechanical Properties of Epoxy Molding Compound

Kim, Junmo; Song, Myoung; Gu, Chang-Yeon; Ma, Sung Woo; Jeong, Mu-Hyeon; Lee, Jin Hee; Lee, Woong-Sun; et al, The 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 2023, IEEE, 2023-03-08

5
Tensile Properties of ALD Alumina without Substrate Measured by Tensile Testing on Water Surface

Lee, Sangmin; Koo, Junmo; Kim, Junmo; Shim, Joon-Hyung; Kim, Taek-Soo, 2019 MRS Fall Meeting & Exhibit, Materials Research Society, 2019-12-02

6
Thermo-Mechanical Behavior of Molded Underfill Filling the Sub-100μm Die Gap for Advanced Packaging

Ju, Min Sang; Kim, Junmo; Gu, Chang-Yeon; Song, Myoung; Ma, Sung Woo; Lee, Jin Hee; Lee, Woong-Sun; et al, The 21st International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2023-10-27

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