Browse "ME-Conference Papers(학술회의논문)" by Author Park A.-Y.

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Development of inclined conductive bump (ICB) for flip-chip interconnection

Park A.-Y.; Kim S.-R.; Yoo C.D.; Kim, Taek-Soo, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.880 - 885, ECTC, 2011-05-31

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