Browse "ME-Conference Papers(학술회의논문)" by Title
Showing results 6801 to 6820 of 15924
| Measurement of mechanical properties of St 37 material at high strain rates using a split hopkinson pressure bar Afdhal; Gunawan, Leonardo; Santosa, Sigit P; Putra, Ichsan S; Huh, Hoon, 5th International Conference on Mechanical and Manufacturing Engineering 2014, ICME 2014, pp.562 - 566, Trans Tech Publications Ltd, 2014-10 |
| Measurement of partially specular objects by controlling imaging range Jeong J.; Hong D.; Cho, Hyungsuck, Optomechatronic Computer-Vision Systems II, 2007-10-08 |
| Measurement of parts deformation and misalignment by using a visual sensing system Kim J.Y.; Cho, Hyungsuck; Kim S., Proceedings of the 1997 IEEE International Symposium on Computational Intelligence in Robotics and Automation, CIRA, pp.362 - 367, IEEE, 1997-07-10 |
| Measurement of point-spread function (PSF) for confocal fluorescence microscopy Song I.; Yoo H.; Choo J.; Gweon, Dae-Gab, Advanced Characterization Techniques for Optics, Semiconductors, and Nanotechnologies II, v.5878, pp.1 - 9, 2005-08-02 |
| Measurement of Polarization Dependent Loss of Fiber Optic Components Using a Polarization Scrambler Kim, Jungwon; Kim, T. H.; Lee, B. W., 제 10회 광자기술 학술회의, 2001-11-02 |
| MEASUREMENT OF PSF IN CONFOCAL SELF-INTERFERENCE MICROSCOPY Kang, DK; Yoo, HK; Gweon, Dae-Gab, Focus on Microscopy 2006, 2006-04-09 |
| Measurement of R-values at Intermediate Strain Rates using a Digital Speckle Extensometry J. Huh; Y.J. Kim; Huh, Hoon, SEM 2011, SEM 2011, 2011-06-12 |
| Measurement of Source Parameters of an Automotive Intake System at Constant RPM Ih, Jeong-Guon, Inter noise, pp.0 - 0, 2004-08-01 |
| Measurement of sub-micrometer features based on the topographic contrast using reflection confocal microscopy Gweon, Dae-Gab; Lee, SW; Kang, DK; Yoo, HK; Kim, TJ; Lee, SW; Kim, KS, 2nd International Symposium on Nano-manufacturing, Optical Society of Korea, 2004-11-03 |
| Measurement of Surface Plasmon Polariton Characteristics in Nano Slit - Groove with Phase Spectroscopy Kim, Dae Hee; Lee, Injae; Park, Yeongho; Park, Junhyeong; Kim, Seung-Woo; KIM, Young-Jin, The 18th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE NEMS 2023), IEEE-NEMS(nano/micro engineering molecular system), 2023-05-16 |
| Measurement of the 3-D shapes of specular objects using recursive triangulation Cho, Hyungsuck, Pacific Conf. On Manufacturing, pp.389 - 394, 1996 |
| Measurement of the Acoustic Source Characteristics of the Intake Port in the Refrigerator Compressor Ih, Jeong-Guon; Jang, SH; Kim, SJ; Shim, JS, 1998 International Compressor Engineering Conference, pp.561 - 564, 1998 |
| Measurement of the Catheter Motion for Catheter Simulation LI, CHENGJIE; Lee, Doo Yong, 2021 The 21st International Conference on Control, Automation and Systems (ICCAS 2021), ICCAS, 2021-10-14 |
| Measurement of the DBTT in 3.4% silicon steel by tensile tests at high strain rate using a servo-hydraulic machine Kwon, Junbeom; Huh, Hoon; Kim, Jae Song, WCCM XII&APCOM VI, The Secretariat of WCCM XII & APCOM VI, 2016-07-28 |
| Measurement of the degree of cure of glass fiber-epoxy composites using dielectrometry Bang K.G.; Kwon J.W.; Lee, Dai Gil; Lee J.W., 5th Asia Pacific Conference on Materials Processing, v.113, no.40546, pp.209 - 214, 2001-06-25 |
| Measurement of the effect of surface topology on friction by tip test Im, Yong-Taek; Jung, K.-H.; Lee, H.-C.; Ajiboye, J.S.; Kang, S.-H., ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009, pp.593 - 601, ASME, 2009-10-04 |
| Measurement of the Size of Electrosprayed Droplets Emitted from the Taylor Cone in Vacuum Ku, BK; Kim, Sang Soo, 19th Annual Conference of the American Association for Aerosol Research (AAAR), The American Association for Aerosol Research(AAAR), 2000-11-06 |
| Measurement of Thermal Deformations of Chip Scale Packages Using Moire Interferometry Ham, SJ; Hwang, TK; Lee, Soon-Bok, SEMICON Korea Technical Symposium 2001, Serial 14, pp.239 - 244, 2001 |
| Measurement of Thermal Deformations of Electronic packages using Moire Interferometry Lee, Soon-Bok; Ham, SJ, KSME 2000 Conference of Materials and Frcture Division, pp.314 - 320, 2000 |
| Measurement of Thermal Expansion Coefficient of FR4 Using Digital Image Correlation System for Warpage Prediction of Package Substrate Lee, TI; Kim, C; Kim, MS; 김택수, 2014 KSPE Fall Meeting, KSPE, 2014-10-29 |
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