Browse "ME-Conference Papers(학술회의논문)" by Type Conference
Showing results 10321 to 10380 of 15772
| Thermal crack initiation of high alloy steel slab after continuous casting process through finite element analysis Lee, Yong Seok; Kim, Seong Woo; Lee, You Ho; Lee, Soon Bok, Asian Conference on Experimental Mechanics(ACEM) 2016, KSME Materials and Fracture Division / Reliability Division, 2016-11-16 |
| Thermal Cycling Reliability Issue of Thick Cu Column Based Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates for Fine Pitch Applications Lee, Soon-Bok; Son, HY; Kim, I; Park, JH; Jung, GJ; Park, BJ; Byun, KY; et al, EPTC 2008, 2008 |
| Thermal cycling reliability of Cu/SnAg double-bump flip-chip assemblies for 100um pitch applications Son, HY; Kim, IH; Lee, Soon-Bok; Jung, GJ; Park, BJ; Paik, KW, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
| Thermal Deformations of CSP Assembly during Temperature Cycling and Power Cycling Ham, SJ; Lee, Soon-Bok, Int. symposium on Electronic Materials and Packaging, Serial 11, pp.350 - 357, IEEE, 2000-11 |
| Thermal design of the conduction-cooled AC high temperature superconducting magnet below 10 K Kwon, Dohoon; Kim, Bokeum; Jeong, Sangkwon, Applied Superconductivity Conference 2022, IEEE Council on Superconductivity, 2022-10-24 |
| Thermal Efficiency and Economics of a Boil-Off Hydrogen Re-Liquefaction System Considering the Energy Efficiency Design Index for Liquid Hydrogen Carriers 최민수; 장대준; 정원관; 이상혁; 정태환, 한국해양과학기술협의회 공동학술대회, 한국해양과학기술협의회, 2022-06-03 |
| Thermal forming and straightening of weld distortion by solving inverse problems of line heating Na, Suck-Joo; W.-J.Seong; M.-S.Han, Int. Seminar on Numerical Simulation of Weldability, 2009 |
| Thermal insulation performance in 4 K to 2 K JT refrigeration system 김경중; 배준혁; 박세현; Lingxue, Jin; 정상권, 2018 한국초전도저온공학회 동계학술대회, 한국초전도저온공학회, 2018-01-16 |
| Thermal Lab-on-a-chip with a PVC-gel Heater Kim, MinKi; ko, eunmin; Kim, Seung Seop; Shin, Jennifer Hyunjong; Kyung, Ki-Uk, The 18th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2023, Institute of Electrical and Electronics Engineers (IEEE), 2023-05-15 |
| Thermal loading measurement and thermal fatigue test for solder bumps in electronncs packaging Park, TS; Lee, Soon-Bok, KSME 99 Conference of Materials and Fracture Division, KSME 99MF27, pp.55 - 60, 1999 |
| Thermal Management in EV Inverters: Optimizing Jet Impingement Cooling with Micropost Integration Kim, Seungwoo; Ki, Seokgan; Bang, Soosik; Han, Sanghyung; Seo, Junyong; Ahn, Chulmin; Maeng, Suhyeon; et al, The 21st International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2023-10-27 |
| Thermal Management Utilizing Ga-based Liquid Metals Nam, Youngsuk, ISHMT Golden Jubilee Lecture series, Indian Society for Heat and Mass Transfer (ISHMT), 2023-04-27 |
| Thermal Management Utilizing Gallium-Based Liquid Metals 남영석, 2023 대한기계학회 열공학부문 춘계학술대회, 사단법인 대한기계학회, 2023-04-20 |
| Thermal Optimization of a Miniature Heat Pipe with a Grooved Wick Structure Encountered in Electronic Equipment Cooling Seo, J.K.; Kim, SungJin; Hwang, G., Proc. of 4th JSME-KSME Thermal Engineering Conference, v.1, pp.675 - 680, 2000 |
| Thermal optimization of heat sinks using the topology optimization method considering shape-dependent convection effects Joo, Younghwan; Lee, Ikjin; Kim, Sung-Jin, 12th Japan-Korea-China Student Symposium, Tokyo Institute of Technology, 2018-03-16 |
| Thermal optimization of internally finned-tube in natural convection Kim, Sung Jin; Joo, Younghwan, First Thermal and Fluids Engineering Summer Conference, ASTFE, 2015-08-11 |
| Thermal optimization of microchannel heat sink with pin fin structures Kim, D.; Kim, SungJin, 2003 ASME International Mechanical Engineering Congress, v.3, pp.593 - 602, 2003-11-15 |
| Thermal Optimization of Microchannel Heat Sinks Kim, SungJin, 2000 IAMS International Seminar, pp.20 - 27, 2000 |
| Thermal Optimization of Plate-fin heat sinks with variable fin thickness Kim, Dong Kwon; Jung, Jaehoon; Kim, SungJin, The International Heat TransferConference(IHTC-14), 2010-08-08 |
| Thermal Packaging Utilizing Gallium-Based Liquid Metals Ki, Seokgan; Nam, Youngsuk, IEEE Electron Devices Technology and Manufacturing Conference 2023, IEEE Electron Devices Society, 2023-03-08 |
| Thermal Performance Improvement of a heat sink with piezoelectric vibrating fins Park, Hee Seung; Kim, SungJin, The International Heat TransferConference(IHTC-14), 2010-08-08 |
| Thermal performance of a natural convection heat sink with a flap heat-pipe type base plate Hyun, Jae Min; Ji,T.H.; Kim ,S.Y.; Karng,S.W., The 6th KSME-JSME Thermal & fluids Engineering Conference, 2005 |
| Thermal properties measurements of liquids using pulse operation with heater integrated microchannel resonators 고주희; 이정철; 이봉재, 대한기계학회 열공학부문 2021년 춘계학술대회, 대한기계학회, 2021-05-28 |
| THERMAL RESPONSE CHARACTERISTICS OF HTS (HIGH TEMPERATURE SUPERCONDUCTOR) BULK UNDER VARING MAGNETIC FIELD CONDITIONS Ko, Junseok; Jeong, Sangkwon; Jung, Seyong; Yu, Daejun; Hwang, Kyuwan; Han, Younghee; Sung, Taehyun, International Cryogenic Engineering Conference, pp.0 - 0, 2006-07 |
| Thermal SMA를 이용한 C.elegans 모방로봇의 디자인 및 컨트롤 육현우; 신현정; 조성호, 대한기계학회 2010년도 바이오공학부문 춘계학술대회 , pp.133 - 133, 대한기계학회, 2010-04-29 |
| Thermal SMA를 이용한 C.elegans 모방로봇의 디자인 및 컨트롤 육현우; 조성호; 신현정, 2010 대한기계학회 바이오공학부문 춘계학술대회, pp.133, 대한기계학회, 2010-05-01 |
| Thermal Stability and Performance Enhancement of Layer-structured Platinum Cathode in Solid Oxide Fuel Cell by Protecting Layer of Samarium Doped Ceria Lee, Suhan; Noh, Beom-Rae; Yoon, Yong Jin, NANO KOREA 2021, Korea Nanotechnology Research Society(KoNTRS), 2021-07-08 |
| Thermal Stability of Metal Supported and Perovskite-structured Catalysts for Diesel-Partial Oxidation Reforming Yoon Sangho; Lee Sangho; Bae Joongmyeon, FUCE 2010 (Fuel Cells Science and Technology 2010), Elsevier, 2010-10-06 |
| Thermal transient characteristics of current leads for superconducting equipment Jeong, Sangkwon; In, Sehwan, International Cryogenic Engineering Conference, pp.629 - 632, 2002-07 |
| Thermal-Metallurgical-Mechanical Analysis of Weldment Based on the CFD Simulation Cheon, Jason Hyeonpil; Na, Suck-Joo, International Workshop on Intelligentized Welding Manufacturing (IWIWM), pp.3 - 23, Springer Singapore, 2017-06 |
| Thermally Induced Deformation Measurement of Through-Silicon Via (TSV) Structures using an Atomic Force Microscope (AFM) Moiré Method Jang, Jae-Won; Lee, Soon-Bok, IEEE Nano 2012, IEEE, 2012-08-20 |
| Thermally induced flow oscillation in vertical two-phase natural circulation loop Lee, Sang Yong; Ishii, Mamoru, The Third International Topical Meeting on Nuclear Power Plant Thermal Hydraulics and Operations, The Third International Topical Meeting on Nuclear Power Plant Thermal Hydraulics and Operations, 1988-11 |
| Thermally-driven convection of a compressible fluid in a rapidly rotating cylinder Hyun, Jae Min; Park, J.K., Hemisphere Publ. Corp., pp.365 - 374, 1989 |
| Thermo-acoustic Instability in a Combustor with Branch Tube Park, Jang Hee; Guahk, Young Tae; Shin, Hyun Dong, , JSME-KSME, 2008 |
| Thermo-elastic Frictional Contact Analysis of an Aircraft Braking System KWAK BYUNG MAN, pp.889 - 894, 2001-06-01 |
| Thermo-Elasto-Plastic Finite Element Analysis of Quenching Process of Carbon Steel Kang, S.H; Im, Yong-Taek, The Seventh Asia Pacific Conference on Materials Processing, pp.70 -, APCMP, 2006-12-05 |
| Thermo-Elastohydrodynamic Analysis of Connecting Rod Bearing in Internal Combustion Engine Kim, BJ; Kim, Kyung-Woong, ASME/STLE International Joint Tribology Conference, 2000-10-01 |
| Thermo-Elastohydrodynamic Analysis of Connecting Rod Bearing: Application to Connecting Rod Bearing Design Kim, BJ; Kim, Kyung-Woong, STLE/ASME International Joint Tribology Conference, 2001-10-01 |
| Thermo-Mechanical Behavior of Molded Underfill Filling the Sub-100μm Die Gap for Advanced Packaging Ju, Min Sang; Kim, Junmo; Gu, Chang-Yeon; Song, Myoung; Ma, Sung Woo; Lee, Jin Hee; Lee, Woong-Sun; et al, The 21st International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2023-10-27 |
| Thermo-Mechanical Reliability Assessment of Thin Electronic Packages with High Density Interconnects using Moire Methods Lee, Soon-Bok, SEM Fall Conference 2014, SEM Fall Conference 2014, 2014-10-21 |
| Thermo-Rigid Viscoplastic Finite Element Approach for Flow Simulation of Compression Molding of Thermoset Composites Kim, S.Y; Cheon, J.S; Im, Yong-Taek, Pacific Forum on Intelligent Processing and Manufacturing of Materials , pp.857 - 863, 1997-07 |
| Thermo-Viscoplasic Analysis of Hypersonic Structures Subjected to Severe Aerodynamic Heating Thornton, EA; Oden, JT; Tworzydlo, WW; Youn, Sung-Kie, AIAA/ASME/ASCE/AHS 30th Structures, Structural Dynamics and Materials, and materials Conference, 1989 |
| Thermochromic display system for point-of-care diagnostics Park, Jinsoo; Ha, Byung Hang; Destgeer, Ghulam; Jung, Jin Ho; Sung, Hyung Jin, 18th Korean Micro Electro Mechanical Systems Conference (KMEMS), (사)마이크로나노시스템학회의, 2016-04-08 |
| Thermochromic point-of-care display system using acoustothermal heating Park, Jinsoo; Ha, Byung Hang; Destgeer, Ghulam; Jung, Jin Ho; Sung, Hyung Jin, International Conference of Microfluidics, Nanofluidics and Lab-on-a-Chip (ICMFLOC), International Conference of Microfluidics, Nanofluidics and Lab-on-a-Chip (ICMFLOC), 2016-06-10 |
| Thermocompression transfer printing process for improved bonding between nanowires and metal electrodes Park, Inkyu; Lee, WS; Lee, JH, Nanoimprint and Nanoprint Technology 2011, Nanoimprint and Nanoprint Technology 2011, 2011-10-20 |
| Thermodynamic analysis for CSP integrated direct fired S-CO2 power cycle Son, Seongmin; Jeon, Min-kyu; Heo, Jin Young; JANG, GYU MIN; Baik, Seungjoon; Kim, Dokyu; Aqil, Jamal; et al, 14th International Conference of Greenhouse Gas Control Technology, IEAGHG, 2018-10-22 |
| Thermodynamic analysis of self-pressurized liquid nitrogen cryogenic storage tank Seo, Mansu; Jeong, Sangkwon, JSME-KSME Thermal and fluids engineering conference, 2008 |
| Thermodynamic Design of Hydrogen Joule Thomson Refrigeration Cycles for Hydrogen Liquefaction 김진욱; 김경중; 박태진; 정상권, 2021년 한국수소및신에너지학회 추계학술대회, 한국수소및신에너지학회, 2021-10-21 |
| THERMODYNAMIC PERFORMANCE ANALYSIS AND OPTIMIZATION OF LIQUID AIR ENERGY STORAGE SYSTEM BY ENUMERATION Kim, Juwon; Chang, Daejun, International Conference on Applied Energy, Applied Energy, 2019-08-15 |
| Thermoelastic analysis of an interfacial crack in bimaterial Kim T.W.; Im S.; Earmme, Youn-Young, Proceedings of the KSME/JSME Joint Conference, pp.403 - 408, 1990-07-06 |
| Thermoelastic Analysis of an Interfacial Crack in Bimaterials Kim,T.W.; Im, Seyoung; Earmme, Youn-Young, KSME/JSME joint conference on Fracture and Strength, v.0, no.0, pp.514 - 519, 1990-08 |
| Thermomechanical fatigue behavior of ferritic stainless steel Lee, Soon-Bok; Lee, Keum-Oh; Hong, Seong-Gu; Yoon, Samson; Kim, Bong-Soo, APCFS(Asian Pacific Conf for Fracture and Strength)'04, pp.190 - 190, 2004 |
| Thermomechanical Fatigue Deformation Approach Using Bi-Linear Model Lee, Soon-Bok; Lee, Keum-Oh, Tokyo Tech-KAIST joint workshop, pp.38 - 39, 2005 |
| Thermomechanical Fatigue of the Ferritic Stainless Steel 429EM Lee, Soon-Bok; Lee, Keum-oh; Yoon, Samson, FEOFS 2003, 2003 |
| Thermomechanical Reliability for Emerging Device Technologies: Implications for ULK Integration, 3-D Structures and Packaging Kim, Taek-Soo; R.H. Dauskardt, 2009 IEEE International Reliability Physics Symposium, IEEE, 2009-04-26 |
| Thermomechanical Stress Analysis of Multilayer PCBs Consisting of Metals and Viscoelastic Polymers Earmme, Youn-Young, International Conference on Fracture & Strength of Solids, 2000 |
| THERMOPHORESIS OF SMALL PARTICLES IN COMBINED RADIATION CONVECTION LAMINAR TUBE FLOW WITH HIGH PARTICLE MASS LOADING Park, Sung Ho; Kim, Sang Soo, Proceedings of the 6th International Symposium on Transport Phenomena in Thermal Engineering, pp.601, 대한기계학회, 1993-05-09 |
| Thermophoretic Deposition in Low Temperature Range Lee, BU; Kim, Sang Soo, the 1st Asia Aerosol Conference, 1999-07-27 |
| Thermophoretic Transport and Deposition of Scattering Particle in High Particle Concentration Park, SH; Kim, Sang Soo, Proceedings of the 4th International Aerosol Conference, pp.316 - 316, 1994-08-28 |
| Thermophysical properties and phase change measurements for ultrasmall volume liquids using heater integrated microchannel resonators 고주희; 이봉재; 이정철, 2022, 제24회 한국 MEMS 학술대회, 마이크로나노시스템학회, 2022-04-06 |
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Date issued
- 1,998 2020 - 2024
- 5,805 2010 - 2019
- 5,182 2000 - 2009
- 2,464 1990 - 1999
- 454 1980 - 1989