MS-Journal Papers(저널논문)

Recent Items

Collection's Items (Sorted by Submit Date in Descending order): 3501 to 3520 of 7246

3501
Effects of surface morphology on retention loss of ferroelectric domains in poly(vinylidenefluoride-co-trifluoroethylene) thin films

Choi, Hyun-Woo; Hong, Daniel Seungbum; Sung, Tae-Hyun; No, Kwang-Soo, APPLIED PHYSICS LETTERS, v.99, no.9, 2011-08

3502
The piezoresponse force microscopy investigation of self-polarization alignment in poly(vinylidene fluoride-co-trifluoroethylene) ultrathin films

Park, Moon-Kyu; Choi, Yoon-Young; Kim, Ji-Yoon; Hong, Jong-In; Song, Han-Wook; Sung, Tae-Hyun; No, Kwang-Soo, SOFT MATTER, v.8, no.4, pp.1064 - 1069, 2012

3503
Low temperature epitaxial growth and characterization of Ga-doped ZnO thin films on Al2O3 (0001) substrates prepared with different buffer layers

Shin, Seung Wook; Agawane, G. L.; Kim, In Young; Kwon, Ye Bin; Jung, In Ok; Gang, Myeng Gil; Moholkar, A. V.; et al, APPLIED SURFACE SCIENCE, v.258, no.12, pp.5073 - 5079, 2012-04

3504
Dislocation-Eliminating Chemical Control Method for High-Efficiency GaN-Based Light Emitting Nanostructures

Kim, Je-Hyung; Oh, Chung-Seok; Ko, Young-Ho; Ko, Suk-Min; Park, Ki-Yon; Jeong, Myoungho; Lee, JeongYong; et al, CRYSTAL GROWTH DESIGN, v.12, no.3, pp.1292 - 1298, 2012-01

3505
Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection

Lee, Ki-Won; Kim, Hyoung-Joon; Yim, Myung-Jin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.32, no.4, pp.241 - 247, 2009-10

3506
Nonconductive Films (NCFs) With Multifunctional Epoxies and Silica Fillers for Reliable NCFs Flip Chip on Organic Boards (FCOBs)

Chung, Chang-Kyu; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.32, no.2, pp.65 - 73, 2009-04

3507
Enhanced Electrical Conductivity of Nanocomposites Containing Hybrid Fillers of Carbon Nanotubes and Carbon Black

Ma, PC; Liu, MY; Zhang, H; Wang, SQ; Wang, R; Wang, K; Wong, YK; et al, ACS APPLIED MATERIALS & INTERFACES, v.1, pp.1090 - 1096, 2009-05

3508
Reduced Temperature Coefficient of Capacitance (TCC) of Embedded Capacitor Films (ECFs) for Organic Substrates using SrTiO3 and Multifunctional Epoxy

Lee, Sangyong; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.8, pp.1358 - 1363, 2010-08

3509
Effects of Heating Rate on Material Properties of Anisotropic Conductive Film (ACF) and Thermal Cycling Reliability of ACF Flip Chip Assembly

Jang, Kyung-Woon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.32, no.2, pp.339 - 346, 2009-06

3510
Effects of Anisotropic Conductive Film Viscosity on ACF Fillet Formation and Chip-On-Board Packages

Jang, Kyung-Woon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.32, pp.74 - 80, 2009-04

3511
High Power and High Reliability Flex-On-Board Assembly Using Solder Anisotropic Conductive Films Combined with Ultrasonic Bonding Technique

Lee, Ki-Won; Saarinen, Ilkka J.; Pykari, Lasse; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.12, pp.1901 - 1907, 2011-12

3512
Effect of Ag Addition on the Ripening Growth of Cu6Sn5 Grains at the Interface of Sn-xAg-0.5Cu/Cu During a Reflow

Cho, Moon-Gi; Park, Yong-Sung; Seo, Sun-Kyoung; Paik, Kyung-Wook; Lee, Hyuck-Mo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.12, pp.1939 - 1946, 2011-12

3513
Characterization of deep levels in a-plane GaN epi-layers grown using various growth techniques

Song, Hoo-Young; Kim, Eun-Kyu; Baik, Kwang-Hyeon; Hwang, Sung-Min; Jang, Yong-Woon; Lee, Jeong-Yong, JOURNAL OF CRYSTAL GROWTH, v.340, no.1, pp.23 - 27, 2012-02

3514
CO Oxidation Mechanism on CeO2-Supported Au Nanoparticles

Kim, Hyun You; Lee, HyuckMo; Henkelman, Graeme, JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, v.134, no.3, pp.1560 - 1570, 2012-01

3515
Improvement of Device Performance by Optimizing the Advanced DCV Process Condition in Dual-Damascene Cu Interconnects

Lee, Min Hyung; Lee, Han Choon; Park, Chul Ho; Han, Jae-Won; Paik, Kyung-Wook, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.156, no.8, pp.644 - 647, 2009-06

3516
Moisture induced interface weakening in ACF package

Sim, Gidong; Chung, Chang-Kyu; Paik, Kyung-Wook; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.528, no.2, pp.698 - 705, 2010-12

3517
Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections

Kim, Il; Jang, Kyung-Woon; Son, Ho-Young; Kim, Jae-Han; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.5, pp.792 - 797, 2011-05

3518
Effects of the Degree of Cure on the Electrical and Mechanical Behavior of Anisotropic Conductive Films

Chung, Chang-Kyu; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.39, pp.410 - 418, 2010-04

3519
Improved Optical Transmittance of Boron Doped ZnO Thin Films by Low Pressure Chemical Vapor Deposition with Pulse Boron Doping

Lee, Chang-Soo; Yoon, Kyung-Hoon; Ahn, Byung-Tae, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.158, no.5, pp.482 - 486, 2011

3520
Sodium-doping of ZnTe film by close-spaced sublimation for back contact of CdTe solar cell

Park, Kwang Chun; Cha, Eun Seok; Ahn, Byung Tae, CURRENT APPLIED PHYSICS, v.11, no.1, pp.109 - 112, 2011-01

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