Browse "MS-Journal Papers(저널논문)" by Subject solder bump
Showing results 1 to 3 of 3
| A study on coining processes of solder bumps on organic substrates Nah, JW; Paik, Kyung-Wook; Hwang, TK; Kim, WH, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.26, pp.166 - 172, 2003-04 |
| Effect of the Curing Properties and Viscosities of Nonconductive Films on the Solder Joint Morphology and Reliability of Chip-On-Board Packages Using Cu-Pillar/Sn-Ag Bumps Lee, Hanmin; Lee, Seyong; Choi, Taejin; Park, Sooin; Ko, Eun Kyoung; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.5, pp.924 - 928, 2020-05 |
| Investigation of flip chip under bump metallization systems of Cu pads Nah, JW; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.32 - 37, 2002-03 |
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