Browse "MS-Journal Papers(저널논문)" by Subject PCB
Showing results 1 to 4 of 4
| A study on coining processes of solder bumps on organic substrates Nah, JW; Paik, Kyung-Wook; Hwang, TK; Kim, WH, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.26, pp.166 - 172, 2003-04 |
| Effects of Temperature and Operation Parameters on the Galvanic Corrosion of Cu Coupled to Au in Organic Solderability Preservatives Process Oh, Se-Kwon; Kim, YoungJun; Jung, Ki Min; Kim, Jongsoo; Shon, MinYoung; Kwon, HyukSang, METALS AND MATERIALS INTERNATIONAL, v.23, no.2, pp.290 - 297, 2017-03 |
| Galvanic Corrosion of Cu Coupled to Au on a Print Circuit Board; Effects of Pretreatment Solution and Etchant Concentration in Organic Solderability Preservatives Soft Etching Solution Oh, Se-Kwon; Kim, YoungJun; Shon, MinYoung; Kwon, Hyuk-Sang, METALS AND MATERIALS INTERNATIONAL, v.22, no.5, pp.781 - 788, 2016-09 |
| Ni/Au 및 OSP로 Finish 처리한 PCB 위에 스크린 프린트 방법으로 형성환 Sn-37Pb, Sn-3.5Ag 및 Sn-3.8Ag-0.7Cu 솔더 범프 계면 반응에 관한 연구 나재웅; 손호영; 백경욱; 김원희; 허기록, 한국재료학회지, v.12, no.9, pp.750 - 760, 2002-09 |
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