Browse "MS-Journal Papers(저널논문)" by Subject FATIGUE

Showing results 1 to 36 of 36

1
A Study on the Fabric Substrates With Fine-Pitch Laminated Cu Metal Patterns Using B-Stage Adhesive Films

Jung, Seung-Yoon; Oh, Seung Jin; Lee, Tae-Ik; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.1, pp.176 - 183, 2020-01

2
Characterization for crystallization of SrBi2Nb2O9 thin films on Si substrates

Yoo, DC; Lee, JeongYong; Sinclair, R; Kim, IS; Kim, YT, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.42, pp.S450 - S453, 2003-02

3
Characterization of LSCO/Ir and LSCO/Ru structure as diffusion barrier layers for highly integrated memory devices

Kim, Il-Doo; Han, KY; Kim, Ho Gi, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.7, no.2, pp.11 - 14, 2004-02

4
Characterization of sensitivity and resolution of silicon resistive probe

Kim, Junsoo; Lee, Jaehong; Song, Ickhyun; Lee, Jong Duk; Park, Byung-Gook; Hong, Seungbum; Ko, Hyoungsoo; et al, JAPANESE JOURNAL OF APPLIED PHYSICS, v.47, no.3, pp.1717 - 1722, 2008-03

5
Characterization of the Property Degradation of PZT Thin Films with Thickness

Song, Han Wook; No, Kwangsoo, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.58, no.4, pp.809 - 816, 2011-04

6
Chip warpage damage model for ACA film type electronic packages

Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005

7
Correlation between grain size and domain size distributions in ferroelectric media for probe storage applications

Kim, Y; Cho, Y; Hong, Daniel Seungbum; Buhlmann, S; Park, H; Min, DK; Kim, SH; et al, APPLIED PHYSICS LETTERS, v.89, pp.928 - 936, 2006-10

8
Crystal orientation of beta-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints

Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.25, no.10, pp.1950 - 1957, 2010-10

9
CYCLIC PLASTIC STRAIN-ENERGY AS A DAMAGE CRITERION AND ENVIRONMENTAL-EFFECT IN NB-BEARING HIGH-STRENGTH, LOW-ALLOY STEEL

CHUNG, YW; Lee, Won-Jong, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.186, no.1-2, pp.121 - 128, 1994-10

10
CYCLIC SURFACE DEFORMATION-BEHAVIOR OF ZRH2-PURIFIED IRON - EFFECTS OF SOLUTE CARBON, STRAIN AMPLITUDE, STRAIN RATE AND ENVIRONMENT

Lee, Won-Jong; FINE, ME; CHUNG, YW, JOURNAL OF MATERIALS SCIENCE, v.26, no.21, pp.5793 - 5798, 1991-11

11
Damage-resistant brittle coatings

Lawn, BR; Lee, KS; Chai, H; Pajares, A; Kim, Do Kyung; Wuttiphan, S; Peterson, IM; et al, ADVANCED ENGINEERING MATERIALS, v.2, no.11, pp.745 - 748, 2000-11

12
Direct Visualization of Cross-Sectional Strain Distribution in Flexible Devices

Lee, Tae-Ik; Jo, Woosung; Kim, Wansun; Kim, Ji-Hye; Paik, Kyung-Wook; Kim, Taek-Soo, ACS APPLIED MATERIALS & INTERFACES, v.11, no.14, pp.13416 - 13422, 2019-04

13
Effect of starting powder on damage resistance of silicon nitrides

Lee, SK; Lee, KS; Lawn, BR; Kim, Do Kyung, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.81, no.8, pp.2061 - 2070, 1998-08

14
Effects of surface oxide layers on crack initiation and growth of HSLA steel under cyclic loading in air and in ultrahigh vacuum

Chung, YW; Lee, Won-Jong, JOURNAL OF MATERIALS SCIENCE, v.30, no.24, pp.6370 - 6376, 1995-12

15
Electrical properties of Sb-doped PZT films deposited by dc reactive sputtering using multi-targets

Choi, WY; Ahn, JH; Lee, WJ; Kim, Ho-Gi, MATERIALS LETTERS, v.37, no.3, pp.119 - 127, 1998-10

16
Electronic structure and chemical bonding of Zr substitution of Ti site on Pb(Zr(1-x)Ti(x))O(3) using DV-X alpha method

Kim, YS; Kim, YS; Kim, S; No, Kwangsoo, INTEGRATED FERROELECTRICS, v.64, pp.297 - 303, 2004

17
Electronic structure of bismuth titanate-base films Bi(4-x)Ln(x)Ti(3)O(12) dependence on substitution atom

Kim, Y; Kim, YS; Kim, S; Jeon, YA; No, Kwangsoo, INTEGRATED FERROELECTRICS, v.73, pp.11 - 16, 2005

18
Enhanced interfacial adhesion of patterned Cu-graphene nanolayered composite

Kim, Wonsik; Kim, Sang Min; Han, Seung Min, SCRIPTA MATERIALIA, v.241, 2024-03

19
Evidence for forward domain growth being rate-limiting step in polarization switching in < 111 >-oriented-Pb(Zr0.45Ti0.55)O-3 thin-film capacitors

Hong, SB; Setter, N, APPLIED PHYSICS LETTERS, v.81, no.18, pp.3437 - 3439, 2002-10

20
Ferroelectric properties of (Bi, SM)(4)Ti3O12 (BST) thin films fabricated by a metalorganic solution deposition method

Kim, SS; Choi, EK; Kim, HJ; Park, MH; Lee, HS; Kim, WJ; Bae, JC; et al, JOURNAL OF ELECTROCERAMICS, v.13, pp.83 - 88, 2004-07

21
Ferroelectric properties of heteroepitaxial PbTiO3 and PbZr1-xTixO3 films on Nb-doped SrTiO3 fabricated by hydrothermal epitaxy below Curie temperature

Han, SH; Ahn, WS; Lee, HC; Choi, Si-Kyung, JOURNAL OF MATERIALS RESEARCH, v.22, no.4, pp.1037 - 1042, 2007-04

22
Fracture resistance and contact damage of TiN particle reinforced Si3N4 ceramics

Tatami, J; Chen, IW; Yamamoto, Y; Komastu, M; Komeya, K; Kim, Do Kyung; Wakihara, T; et al, JOURNAL OF THE CERAMIC SOCIETY OF JAPAN, v.114, pp.1049 - 1053, 2006-11

23
High resolution study of domain nucleation and growth during polarization switching in Pb(Zr,Ti)O-3 ferroelectric thin film capacitors

Hong, Daniel Seungbum; Colla, EL; Kim, E; Taylor, DV; Tagantsev, AK; Muralt, P; No, Kwangsoo; et al, JOURNAL OF APPLIED PHYSICS, v.86, no.1, pp.607 - 613, 1999-07

24
Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint

Choi, WK; Kim, JH; Jeong, SW; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.17, no.1, pp.43 - 51, 2002-01

25
LiNbO3 ferroelectric properties on high-and moderate-doped Si substrates

Jung, SW; Kim, YS; Jeong, SH; In, Y; Kim, KH; No, Kwangsoo, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.42, pp.S1386 - S1390, 2003-04

26
Nucleation and grain growth of SrBi2Nb2O9 thin films

Yoo, DC; Lee, JeongYong; Kim, IS; Kim, YT, JOURNAL OF CRYSTAL GROWTH, v.259, pp.79 - 84, 2003-11

27
Piezoresponse force microscopy studies of PbTiO3 thin films grown via layer-by-layer gas phase reaction

Park, Moon-Kyu; Hong, Daniel Seungbum; Kim, Ji-Yoon; Kim, Yun-Seok; Buehlmann, Simon; Kim, Yong-Kwan; No, Kwang-Soo, APPLIED PHYSICS LETTERS, v.94, no.9, 2009-03

28
Preparation and characterization of Pb(Zr,Ti)O-3 films deposited on Pt/RuO2 hybrid electrode for ferroelectric random access memory devices

Lee, HC; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.40, no.11, pp.6566 - 6573, 2001-11

29
Principle of ferroelectric domain imaging using atomic force microscope

Hong, Daniel Seungbum; Woo, J; Shin, H; Jeon, JU; Pak, YE; Colla, EL; Setter, N; et al, JOURNAL OF APPLIED PHYSICS, v.89, no.2, pp.1377 - 1386, 2001-01

30
Processing and mechanical properties of Ti-6Al-4V/TiC in situ composite fabricated by gas-solid reaction

Kim, YJ; Chung, H; Kang, Suk-Joong L, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.333, no.1-2, pp.343 - 350, 2002-08

31
Quantitative analysis of the bit size dependence on the pulse width and pulse voltage in ferroelectric memory devices using atomic force microscopy

Woo, J; Hong, Daniel Seungbum; Setter, N; Shin, H; Jeon, JU; Pak, YE; No, Kwangsoo, JOURNAL OF VACUUM SCIENCE TECHNOLOGY B, v.19, no.3, pp.818 - 824, 2001

32
Relaxation of remanent polarization in Pb(ZrTi)O-3 thin film capacitors

Lee, KW; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.41, pp.6718 - 6723, 2002-11

33
Stability and read/write characteristics of nano ferroelectric domains

No, Kwangsoo; Song, HW; Hong, J; Woo, J; Shin, H; Hong, Daniel Seungbum, FERROELECTRICS, v.259, no.1-4, pp.289 - 298, 2001

34
The effect of grain boundary phase on contact damage resistance of alumina ceramics

Kim, JH; Lee, S; Lee, KS; Kim, Do Kyung, JOURNAL OF MATERIALS SCIENCE, v.39, pp.7023 - 7030, 2004-12

35
The influence of an extrinsic interfacial layer on the polarization of sputtered BaTiO3 film

Cho, YW; Choi, Si-Kyung; Rao, GV, APPLIED PHYSICS LETTERS, v.86, no.20, pp.40 - +, 2005-05

36
The low temperature processing for removal of metallic bismuth in ferroelectric SrBi2Ta2O9 thin films

Kim, Ho Gi, APPLIED SURFACE SCIENCE, v.140, no.1-2, pp.150 - 155, 1999-01

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