Browse "MS-Journal Papers(저널논문)" by Subject 3-D packaging
Showing results 1 to 2 of 2
| Filling of very fine via holes for 3D packaging by using ionized metal plasma sputtering and electroplating CHO, Byeong-Hoon; YUN, Jae-Jin; LEE, Won-Jong, Japanese Journal of Applied Physics, Vol.46, No.46, pp.L1135-L1137, 2007-11-22 |
| Filling of very fine via holes for three-dimensional packaging by using ionized metal plasma sputtering and electroplating Cho, Byeong-Hoon; Yun, Jae-Jin; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS, v.46, no.45-49, pp.L1135 - L1137, 2007-12 |
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