Browse "MS-Journal Papers(저널논문)" by Author Yu, Jin
Showing results 1 to 60 of 125
| A corrosion couple experiment reproducing the black pad phenomenon found after the electroless nickel immersion gold process Kim, K. H.; Yu, Jin; Kim, J. H., SCRIPTA MATERIALIA, v.63, no.5, pp.508 - 511, 2010-09 |
| A geometrical model on the angular effect in Auger electron spectroscopy Yu, Jin, JOURNAL OF MATERIALS SCIENCE, v.25, no.2B, pp.1463 - 1467, 1990-02 |
| A new equation for the Cr equivalent in 9 to 12 Pct Cr steels Ryu, SH; Yu, Jin, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.29, no.6, pp.1573 - 1578, 1998-06 |
| A study on the residual stress measurement methods on chemical vapor deposition diamond films Kim, JG; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.13, no.11, pp.3027 - 3033, 1998-11 |
| Adhesion behavior of CuCr alloy/polyimide films under 350 degrees C and 85 degrees C/85% RH environments Ahn, EC; Yu, Jin; Park, IS; Lee, Won-Jong, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.10, no.12, pp.1343 - 1357, 1996-04 |
| Adhesion strength of leadframe/EMC interfaces Lee, HY; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.28, no.12, pp.1444 - 1447, 1999-12 |
| AN AUGER STUDY ON THE INTERACTION OF CU AND CR FILMS WITH POLYIMIDE Chung, Tae-Gyeong; Kim, Young-Ho; Yu, Jin, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.8, no.1, pp.41 - 51, 1994-01 |
| An elastic/plastic analysis of the intrinsic stresses in chemical vapor deposited diamond films on silicon substrates Yu, Jin; Kim, JG; Chung, JO; Cho, DH, JOURNAL OF APPLIED PHYSICS, v.88, no.3, pp.1688 - 1694, 2000-08 |
| An X-ray study on the mechanical effects of the peel test in a Cu/Cr/polyimide system Park, IS; Yu, Jin, ACTA MATERIALIA, v.46, no.8, pp.2947 - 2953, 1998-05 |
| Analyses of the practical adhesion strengths of the metal/polymer interfaces in electronic packaging Yu, Jin; Song, JY; Park, IS, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.12, pp.1347 - 1352, 2002-12 |
| Analysis of phase transformation kinetics by intrinsic stress evolutions during the isothermal aging of amorphous Ni(P) and Sn/Ni(P) films Song, JY; Yu, Jin; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.4, pp.1257 - 1264, 2004-04 |
| Analysis of the T-peel strength in a Cu/Cr/polyimide system Song, JY; Yu, Jin, ACTA MATERIALIA, v.50, no.16, pp.3985 - 3994, 2002-09 |
| Assessing the thermal conductivity of non-uniform thin-films: Nanocrystalline Cu composites incorporating carbon nanotubes Kang, Stephen D.; Yoo, Jung-Joon; Lyeo, Ho-Ki; Song, Jae-Yong; Lee, Sung-Jun; Yu, Jin, JOURNAL OF APPLIED PHYSICS, v.110, no.2, 2011-07 |
| Behavior of residual stress on CVD diamond films Kim, JG; Yu, Jin, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, v.57, no.1, pp.24 - 27, 1998-12 |
| Black Pad Susceptibility of the Electroless Ni Films on the Cu UBM Kim, J. H.; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.43, no.11, pp.4335 - 4343, 2014-11 |
| Calculation of intrinsic stress by creep deformation of an Si substrate on chemical vapor deposited diamond films Kim, JG; Yu, Jin; Cho, DH; Baik, YJ, DIAMOND AND RELATED MATERIALS, v.9, no.1, pp.61 - 66, 2000-01 |
| CARBIDE STABILITY DIAGRAMS IN 2.25CR-1MO STEELS Yu, Jin, METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.20, no.8, pp.1561 - 1564, 1989-08 |
| Cohesive failure of the Cu/polyimide system Park, IS; Ahn, EC; Yu, Jin; Lee, HY, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.282, no.1-2, pp.137 - 144, 2000-04 |
| Comparative study of residual stresses measurement methods on CVD diamond films Kim, JG; Yu, Jin, SCRIPTA MATERIALIA, v.39, no.6, pp.807 - 814, 1998-08 |
| Comparative study of thermally conductive fillers in underfill for the electronic components Lee, WS; Yu, Jin, DIAMOND AND RELATED MATERIALS, v.14, no.10, pp.1647 - 1653, 2005-10 |
| Controlling Ag3Sn plate formation, in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying Kang, SK; Shih, DY; Leonard, D; Henderson, DW; Gosselin, T; Cho, SI; Yu, Jin; et al, JOM, v.56, no.6, pp.34 - 38, 2004-06 |
| Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection Sohn, YC; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.20, no.8, pp.1931 - 1934, 2005-08 |
| Crack Tip Plasticity in Copper Single Crystals Yu, Jin; Cho, J. W., Solid Mechanics and Its Applications , v.84, no.0, pp.311 - 329, 2002 |
| CREEP CAVITATION IN A NICR STEEL CHO, HC; Yu, Jin; PARK, IS, METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.23, no.1, pp.201 - 210, 1992-01 |
| Creep crack growth in brittle materials Jeon, JY; Lee, YS; Yu, Jin, INTERNATIONAL JOURNAL OF FRACTURE, v.101, no.3, pp.203 - 214, 2000-02 |
| Creep deformation of lead-free Sn-3.5Ag-Bi solders Shin, SW; Yu, Jin, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.42, no.3, pp.1368 - 1374, 2003-03 |
| Creep deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi solder joints Shin, SW; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.2, pp.188 - 195, 2005-02 |
| Creep rupture of lead-free Sn-3.5Ag-Cu solders Joo, DK; Yu, Jin; Shin, SW, JOURNAL OF ELECTRONIC MATERIALS, v.32, no.6, pp.541 - 547, 2003-06 |
| CREEP-RUPTURE BY DIFFUSIVE GROWTH OF CONTINUALLY NUCLEATING CAVITIES Yu, Jin; Chung, JO, SCRIPTA METALLURGICA, v.22, no.1, pp.27 - 30, 1988-01 |
| CREEP-RUPTURE BY DIFFUSIVE GROWTH OF RANDOMLY DISTRIBUTED CAVITIES .1. INSTANTANEOUS CAVITY NUCLEATION Yu, Jin; CHUNG, JO, ACTA METALLURGICA ET MATERIALIA, v.38, no.8, pp.1423 - 1434, 1990-08 |
| CREEP-RUPTURE BY DIFFUSIVE GROWTH OF RANDOMLY DISTRIBUTED CAVITIES .2. CONTINUAL CAVITY NUCLEATION Yu, Jin; Chung, JO, ACTA METALLURGICA ET MATERIALIA, v.38, no.8, pp.1435 - 1443, 1990-08 |
| CREEP-RUPTURE IN A NICKEL-BASED SUPERALLOY KIM, TK; Yu, Jin; JEON, JY, METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.23, no.9, pp.2581 - 2587, 1992-09 |
| CREEP-RUPTURE IN A NICR STEEL CHO, HC; Yu, Jin; PARK, IS, SCRIPTA METALLURGICA ET MATERIALIA, v.24, no.6, pp.1015 - 1020, 1990-06 |
Diffusion-Controlled Solid-State Formation of CoSb Phase from Co/Sb-Multilayered Nanowires Jeon, Seong-Gi; Shin, Ho-Sun; Yu, Jin; Song, Jae-Yong, JOURNAL OF NANOMATERIALS, 2012 |
| Direct formation of a current collector layer on a partially reduced graphite oxide film using sputter-assisted metal deposition to fabricate high-power micro-supercapacitor electrodes Byun, Segi; Yu, Jin, JOURNAL OF POWER SOURCES, v.307, pp.849 - 855, 2016-03 |
| Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations Xia, YH; Jee, YK; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862, 2008-12 |
| Effect of Cu content on the mechanical reliability of Ni/Sn-3.5Ag system Kim, JY; Sohn, YC; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.22, no.3, pp.770 - 776, 2007-03 |
| Effect of interfacial carbide layer on the Raman spectra in chemical-vapor deposited diamond films Kim, JG; Yu, Jin; Lee, JC, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.38, no.2A, pp.777 - 780, 1999-02 |
| Effect of matrix hardness on the creep properties of a 12CrMoVNb steel Lee, YS; Yu, Jin, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.30, no.9, pp.2331 - 2339, 1999-09 |
| EFFECT OF ORDER-DISORDER TRANSFORMATION MODES ON THE ANOMALOUS YIELD BEHAVIOR OF FE3AL INTERMETALLIC COMPOUNDS Park, J. W.; Moon, I. G.; Yu, Jin, JOURNAL OF MATERIALS SCIENCE, v.26, no.11, pp.3062 - 3066, 1991-06 |
| Effect of phosphorous content on phase transformation induced stress in Sn/Ni(P) thin films Song, JY; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.21, no.9, pp.2261 - 2269, 2006-09 |
| EFFECT OF PRIOR AUSTENITE GRAIN-SIZE ON CREEP-PROPERTIES AND ON CREEP CRACK-GROWTH IN 3.5NI-CR-MO-V STEEL Hong,, SH; Yu, Jin, SCRIPTA METALLURGICA, v.23, no.7, pp.1057 - 1062, 1989-07 |
| Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad Jee, YK; Ko, YH; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.22, no.7, pp.1879 - 1887, 2007-07 |
| Effects of Ag on the Kirkendall void formation of Sn-xAg/Cu solder joints Kim, Sung-Hwan; Yu, Jin, JOURNAL OF APPLIED PHYSICS, v.108, no.8, 2010-10 |
| EFFECTS OF BRAZING TEMPERATURE ON THE FRACTURE-TOUGHNESS OF AL2O3/AG-CU-0.5TI JOINTS CHO, HC; Yu, Jin, SCRIPTA METALLURGICA ET MATERIALIA, v.26, no.5, pp.797 - 802, 1992-03 |
| Effects of chemical oxidations on the fracture toughness of leadframe/EMC interfaces Lee, HY; Yu, Jin, METALS AND MATERIALS-KOREA, v.5, no.5, pp.471 - 476, 1999-10 |
| EFFECTS OF COMPOSITION AND CARBIDE PRECIPITATION ON TEMPER EMBRITTLEMENT OF 2.25 CR-1 MO STEEL .1. EFFECTS OF P AND SN Yu, Jin; MCMAHON, CJ, METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.11, no.2, pp.277 - 289, 1980 |
| EFFECTS OF COMPOSITION AND CARBIDE PRECIPITATION ON TEMPER EMBRITTLEMENT OF 2.25 CR-1 MO STEEL .2. EFFECTS OF MN AND SI Yu, Jin; MCMAHON, CJ, METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.11, no.2, pp.291 - 300, 1980 |
| Effects of Cu addition on the creep rupture properties of a 12% Cr steel Ku, BS; Yu, Jin, SCRIPTA MATERIALIA, v.45, no.2, pp.205 - 211, 2001-07 |
| Effects of doping and planar defects on the thermoelectric properties of InAs nanowires Jeon, Seong Gi; Park, Dong Woo; Shin, Ho Sun; Park, Hyun Min; Choi, Si Young; Lee, Sang Jun; Yu, Jin; et al, RSC ADVANCES, v.6, no.10, pp.7791 - 7797, 2016 |
| Effects of electroplated Cu thickness and polyimide plasma treatment conditions on the interfacial fracture mechanics parameters in the Cu/Cr/polyimide system Park, Young Bae; Yu, Jin, METALS AND MATERIALS-KOREA, v.7, no.2, pp.123 - 131, 2001-04 |
| Effects of heat treatment at 350 degrees C on the adhesion of Cu-Cr alloy films to polyimide Ahn, EC; Yu, Jin; Park, IS, JOURNAL OF MATERIALS SCIENCE, v.35, no.8, pp.1949 - 1955, 2000-04 |
| Effects of interfacial Al oxide layers: Control of reaction behavior in micrometer-scale Al/Ni multilayers Kuk, Seoung Woo; Yu, Jin; Ryu, Ho Jin, MATERIALS & DESIGN, v.84, pp.372 - 377, 2015-11 |
| Effects of oxidation treatments on the fracture toughness of leadframe/epoxy interfaces Lee, H.Y.; Yu, Jin, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.277, no.1-2, pp.154 - 160, 2000-01 |
| EFFECTS OF P ADDITION ON CREEP OF 1CR-MO-V STEELS Yu, Jin; GRABKE, HJ, METAL SCIENCE, v.17, no.8, pp.389 - 396, 1983 |
| Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints Lee, K. O.; Yu, Jin; Park, T. S.; Lee, Soon-Bok, INTERNATIONAL JOURNAL OF FATIGUE, v.48, pp.1 - 8, 2013-03 |
| Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Choi, WK, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.7, pp.790 - 795, 2004-07 |
| Effects of reactive diffusion on stress evolution in Cu-Sn films Song, JY; Yu, Jin; Lee, TY, SCRIPTA MATERIALIA, v.51, no.2, pp.167 - 170, 2004-07 |
| Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering Kim, J. Y.; Yu, Jin, APPLIED PHYSICS LETTERS, v.92, no.9, 2008-03 |
| Effects of residual S on Kirkendall void formation at Cu/Sn-3.5Ag solder joints Yu, Jin; Kim, J. Y., ACTA MATERIALIA, v.56, no.19, pp.5514 - 5523, 2008-11 |
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