Black Pad Susceptibility of the Electroless Ni Films on the Cu UBM

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The occurrence of black pad in the electroless Ni film during the immersion gold process is related to the surface morphology of the Ni(P) film. A nonuniform distribution of the nodule size and curvature is the crucial factor. Large nodules with small surface curvatures had higher P concentration and did not corrode, while small nodules with large surface curvatures had lower P concentration and corroded. Experiments using different types of Cu substrates suggest that the Ni(P) film black pad susceptibility increased with the defect density and/or the residual stress in the underlying substrate. Annealing the Cu substrate before the electroless Ni plating greatly reduced the black pad formation.
Publisher
SPRINGER
Issue Date
2014-11
Language
English
Article Type
Article
Keywords

NICKEL IMMERSION GOLD; PCB FINAL FINISHES

Citation

JOURNAL OF ELECTRONIC MATERIALS, v.43, no.11, pp.4335 - 4343

ISSN
0361-5235
DOI
10.1007/s11664-014-3344-6
URI
http://hdl.handle.net/10203/192922
Appears in Collection
MS-Journal Papers(저널논문)
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