Browse "MS-Journal Papers(저널논문)" by Author Yoon, HG
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| Design of new 3-dimensional (3-D) die stack package and process optimization Ko, HS; Kim, JS; Yoon, HG; Paik, Kyung-Wook, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, pp.759 - 764, 1999-12 |
| Development of three-dimensional memory die stack packages using polymer insulated sidewall technique Ko, HS; Kim, JS; Yoon, HG; Jang, SY; Cho, SD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.2, pp.252 - 256, 2000-05 |
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