Browse "MS-Journal Papers(저널논문)" by Author Yoon, HG

Showing results 1 to 2 of 2

1
Design of new 3-dimensional (3-D) die stack package and process optimization

Ko, HS; Kim, JS; Yoon, HG; Paik, Kyung-Wook, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, pp.759 - 764, 1999-12

2
Development of three-dimensional memory die stack packages using polymer insulated sidewall technique

Ko, HS; Kim, JS; Yoon, HG; Jang, SY; Cho, SD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.2, pp.252 - 256, 2000-05

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