Showing results 1 to 18 of 18
Characterization of TiN barriers against Cu diffusion by capacitance-voltage measurement Rha, SK; Lee, SY; Lee, WJ; Hwang, YS; Park, Chong-Ook; Kim, DW; Lee, YS; et al, JOURNAL OF VACUUM SCIENCE TECHNOLOGY B, v.16, no.4, pp.2019 - 2025, 1998-01 |
Comparison of theoretical predictions and experimental values of the dielectric constant of epoxy/BaTiO3 composite embedded capacitor films Cho, SD; Lee, SY; Hyun, JG; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.16, pp.77 - 84, 2005-02 |
Effect of Nafion (R) gradient in dual catalyst layer on proton exchange membrane fuel cell performance Kim, KH; Kim, HJ; Lee, KY; Jang, JH; Lee, SY; Cho, EunAe; Oh, IH; et al, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.33, no.11, pp.2783 - 2789, 2008-06 |
Effect of the pressure on the chemical vapor deposition of copper from copper hexafluoroacetylacetonate trimethylvinylsilane Lee, WJ; Rha, SY; Lee, SY; Kim, DW; Park, Chong-Ook, THIN SOLID FILMS, v.305, pp.254 - 258, 1997-01 |
Effects of the annealing in Ar and H-2/Ar ambients on the microstructure and the electrical resistivity of the copper film prepared by chemical vapor deposition Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook; Chun , Soung Soon, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.35, no.11, pp.5781 - 5786, 1996-11 |
Effects of the integrity of silicon thin films on the electrical characteristics of thin dielectric ONO film Kim, DW; Kim, KJ; Kim, DI; Lee, WJ; Lee, SY; Lee, YJ; Rha, SK; et al, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.8, no.2, pp.91 - 94, 1997-04 |
Effects of the partial pressure of copper (I) hexafluoroacetylacetonate trimethylvinylsilane on the chemical vapor deposition of copper Lee, SY; Rha, SK; Lee, WJ; Kim, DW; Hwang, JS; Park, Chong-Ook, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.36, pp.5249 - 5252, 1997-01 |
Field-aided thermal chemical vapor deposition of copper using Cu(I) organometallic precursor Lee, WJ; Rha, SK; Lee, SY; Park, Chong-Ook, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.144, no.2, pp.683 - 686, 1997-02 |
Grain growth of copper films prepared by chemical vapour deposition Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.8, no.4, pp.217 - 221, 1997-08 |
High-quality epitaxial growth of in situ phosphorus-doped Si films by promoting dispersion of native oxides in alpha-Si Kim, HS; Shim, KH; Lee, SY; Lee, JeongYong; Kang, JY, JOURNAL OF CRYSTAL GROWTH, v.212, no.3-4, pp.423 - 428, 2000-05 |
Improved TiN film as a diffusion barrier between copper and silicon Rha, SK; Lee, WJ; Lee, SY; Hwang, YS; Lee, YJ; Kim, DI; Kim, DW; et al, THIN SOLID FILMS, v.320, no.1, pp.134 - 140, 1998-05 |
Interdiffusions and reactions in Cu/TiN/Ti/Si and Cu/TiN/Ti/SiO2/Si multilayer structures Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook; Chun, SS, JOURNAL OF MATERIALS RESEARCH, v.12, no.12, pp.3367 - 3372, 1997-12 |
Ni3Al precipitation behavior in the two-phase (NiAl+Ni3Al) alloy Lee, JH; Lee, SY; Lee, Zin-Hyoung; Kim, HM, HIGH TEMPERATURE MATERIALS AND PROCESSES, v.18, no.3, pp.125 - 129, 1999-02 |
Oxidation, grain growth and reflow characteristics of copper thin films prepared by chemical vapor deposition Lee, SY; Choi, SH; Park, Chong-Ook, THIN SOLID FILMS, v.359, no.2, pp.261 - 267, 2000-01 |
Reflow of copper in an oxygen ambient Lee, SY; Kim, DW; Rha, SK; Park, Chong-Ook; Park, HH, JOURNAL OF VACUUM SCIENCE TECHNOLOGY B, v.16, no.5, pp.2902 - 2905, 1998-01 |
Reflow of copper in oxygen anneal ambients Lee, SY; Choi, SH; Kang, JY; Park, Chong-Ook, JOURNAL OF APPLIED PHYSICS, v.88, no.10, pp.5946 - 5950, 2000-11 |
Synthesis and characterization of cross-linked poly (ether sulfone) for a fuel cell membrane Heo, KB; Lee, HJ; Kim, HJ; Kim, BS; Lee, SY; Cho, EunAe; Oh, IH; et al, JOURNAL OF POWER SOURCES, v.172, no.11, pp.215 - 219, 2007-10 |
Synthesis and characterization of sulfonated poly(ether sulfone) copolymer membranes for fuel cell applications Krishnan, NN; Kim, HJ; Prasanna, M; Cho, EunAe; Shin, EM; Lee, SY; Oh, IH; et al, JOURNAL OF POWER SOURCES, v.158, no.2, pp.1246 - 1250, 2006-08 |
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