Browse "MS-Journal Papers(저널논문)" by Subject UBM
Showing results 5 to 7 of 7
| Stresses in electroless Ni-P films for electronic packaging applications Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.169 - 173, 2002-03 |
| Studies of electroless nickel under bump metallurgy-solder interfacial reactions and their effects on flip chip solder joint reliability Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.520 - 528, 2002-05 |
| Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability Jeon, Young Doo; Paik, Kyung Wook; Bok, Kyoung Soon; Choi, Woo Suk; Cho, Chul Lae, Journal of Electronic Materials v.31 n.5, 520-528, 2000-01 |
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