Browse "MS-Journal Papers(저널논문)" by Subject JOINTS
Showing results 21 to 36 of 36
| Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging Cho, MG; Paik, Kyung-Wook; Lee, HyuckMo; Booh, SW; Kim, TG, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.1, pp.35 - 40, 2006-01 |
| Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrate Yoon, SW; Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.40, no.3, pp.327 - 332, 1999 |
| Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy Jang, Dong-Min; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.26, no.24, pp.3032 - 3037, 2011-12 |
| Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers Park, Jae-Hyeong; Park, Jong Cheol; Shin, SangMyung; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.11, pp.2152 - 2159, 2019-11 |
| Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 mu m pitch Cu-pillar/Sn-Ag bump interconnection Shin, Ji Won; Kim, Il; Choi, Yong-Won; Kim, Youngsoon; Kang, Un Byung; Jee, Young Kun; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.55, no.2, pp.432 - 441, 2015-02 |
| Prediction of primary intermetallic compound formation during interfacial reaction between Sn-based solder and Ni substrate Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.46, no.11, pp.777 - 781, 2002-06 |
| PREDICTION OF RESIDUAL STRESS-INDUCED CRACKING BY FINITE-ELEMENT ANALYSIS KWEON, SY; Choi, Si-Kyung, SCRIPTA METALLURGICA ET MATERIALIA, v.32, no.3, pp.359 - 364, 1995-02 |
| Rupture time analyses of the Sn-3.5Ag solder alloys containing Cu or Bi Yu, Jin; Joo, DK; Shin, SW, ACTA MATERIALIA, v.50, no.17, pp.4315 - 4324, 2002-10 |
| Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps Lee, JS; Chu, KM; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.20, no.11, pp.3088 - 3093, 2005-11 |
| Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.8, pp.2428 - 2436, 2004-08 |
| Study on the effects of copper oxide growth on the peel strength of copper/polyimide Lee, Hyuek Jae; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.8, pp.1102 - 1110, 2008-08 |
| The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates Zhang, Shuye; Wang, Shaoan; Zhang, Shang; Chen, Xiangyu; Zeng, Chen; Paik, Kyung-Wook; He, Peng, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.7094 - 7099, 2023-11 |
| Thermodynamic issues of lead-free soldering in electronic packaging Jeong, SW; Kim, JH; Lee, Hyuck-Mo, MATERIALS SCIENCE FORUM, v.426-4, pp.4081 - 4086, 2003 |
| Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.50, no.9, pp.2291 - 2296, 2009-09 |
| Wettability and interfacial reactions of Sn-based Pb-free solders with Cu-xZn alloy under bump metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ALLOYS AND COMPOUNDS, v.474, no.1-2, pp.510 - 516, 2009-04 |
| Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate Jung, In-Yu; Cho, Moon-Gi; Lee, Hyuck-Mo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2301 - 2307, 2009-11 |
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