DC Field | Value | Language |
---|---|---|
dc.contributor.author | LEE, HK | ko |
dc.contributor.author | Lee, Jai Young | ko |
dc.date.accessioned | 2013-02-25T09:12:54Z | - |
dc.date.available | 2013-02-25T09:12:54Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1992-05 | - |
dc.identifier.citation | JOURNAL OF MATERIALS SCIENCE LETTERS, v.11, no.9, pp.550 - 553 | - |
dc.identifier.issn | 0261-8028 | - |
dc.identifier.uri | http://hdl.handle.net/10203/61068 | - |
dc.language | English | - |
dc.publisher | CHAPMAN HALL LTD | - |
dc.title | DECOMPOSITION AND INTERFACIAL REACTION IN BRAZING OF SIC BY COPPER-BASED ACTIVE ALLOYS | - |
dc.type | Article | - |
dc.identifier.wosid | A1992HT18800007 | - |
dc.type.rims | ART | - |
dc.citation.volume | 11 | - |
dc.citation.issue | 9 | - |
dc.citation.beginningpage | 550 | - |
dc.citation.endingpage | 553 | - |
dc.citation.publicationname | JOURNAL OF MATERIALS SCIENCE LETTERS | - |
dc.contributor.nonIdAuthor | LEE, HK | - |
dc.type.journalArticle | Article | - |
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