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Results 1-10 of 250 (Search time: 0.006 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Low-Cost & High-Reliability MCM-D Substrate Unit Process Development Paik, Kyung-Wook, International Conference on Electronic Materials, pp.96 - 96, 1998-03-01 | |
| Anisotropic Conductive Films with Area-arrayed Conducting Microbumps Paik, Kyung-Wook, International Conference on Electronic Materials, pp.139 - 139, 1998-03-01 | |
| Characteization of Polymer die-Attach Adhesives on Au and Al surfaces Paik, Kyung-Wook; krishnamurthy; Lester, D, Proceedings of the 1992 Internationl Symposium on Hybrid Mecroelectronics (ISHM) Conference, pp.719 - 724, 1992 | |
| Studies on thin film integral passive components for mixed mode multichip module (MCM) applications Paik, Kyung-Wook, Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology, pp.365 - 368, 1995-12-04 | |
| Development of Uranium-Silicide and U-Mo Alloy Fuels by Centruifugal Atomization Paik, Kyung-Wook, Technical Committee on Research fo Fuel Aimed by Low Fission Gas Release, pp.0 - 0, 1996-10-01 | |
| Oxygen Reactive Ion Beam Etching on Polyimide to Enhance Copper Film Adhesion Paik, Kyung-Wook, Proc. Mat. Res. Soc. Symp, pp.271 - 276, 1988-03-01 | |
| Design and understanding of anisotropic conductive films (ACFs) for LCD packaging Yim, Myung-Jin; Paik, Kyung-Wook, Proceedings of the 1997 1st IEEE International Symposium on Polymeric Electronics Packaging, PEP'97, pp.233 - 242, 1997-10-26 | |
| The Effect of Cu-base Leadframe Oxidation on the Cu/EMC Adhesion Paik, Kyung-Wook, 2nd Pan Pacific Microelectronics Symposium, pp.233 - 239, 1997-02-01 | |
| A Study on the Electrical Conduction Mechanism of Anisotropically Conductive Film(ACF) for LCD Packaging Applications Paik, Kyung-Wook; Yim, MJ; Kim, YK; Hwang, HN, InterPACK'97, pp.65 - 72, 1997-06-01 | |
| Low temperature oxidation of Cu-base leadframe and Cu/EMC interface adhesion Cho, Soon-Jin; Paik, Kyung-Wook, Proceedings of the 1996 MRS Fall Symposium, v.445, pp.275 - 280, Materials Research Society, 1996-12-03 |
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