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Results 21-30 of 250 (Search time: 0.007 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Analytical Approach to Evaluate Shear Stress in flip Chip Interconnection using NCA/ACF Lee, Soon-Bok; Paik, Kyung-Wook; Kwom, WS; Yang, SY, 5th International Symposium on Electronic Materials and Packagings 2003, pp.204 - 209, 2002 | |
| Flip chip assembly on organic boards using anisotropic conductive adhesives/films and nickel/gold bump Yim, MJ; Jeon, YD; Paik, Kyung-Wook, InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', v.26, 1999-06-13 | |
| Evaluation of Thermal Shear Strains in Flips-chip Package by Electronic Speckle Pattern Interferometry (ESPI) Jang, W; Lee, BW; Kim, DW; Nah, JW; Paik, Kyung-Wook; Kwon, D, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2001, pp.310 - 314, 2001-11 | |
| High Reliable Nong-Conductive Adhesives for Flip Chip Interconnections Kwon, WS; Jang, KW; Paik, Kyung-Wook, 3rd International Symposium on Electronic Materials and Packagings 2001, pp.34 - 38, 2001-11 | |
| Novel Anistropic Conductive Adhesives Flip Chip on Organic Substrates For High Frequency Applications Paik, Kyung-Wook; Yim, MJ; Kwon,WS, Proceeding of 2001 Korea-Japan Joint Workshop on Advanced semiconductor Processes and Equipments, pp.0 - 0, 2001-05-01 | |
| Conduction mechanism of Anisotropic Conductive Adhesives (ACAs): Conductor ball deformation and build-up of contraction stresses Kwon, WS; Paik, Kyung-Wook, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.214 - 220, 2005-03-16 | |
| Microwave characterization and comparison of adhesive flip chip interconnects Kwon, WS; Jeon, YD; Lee, JH; Nah, JW; Yim, MJ; Paik, Kyung-Wook, Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.273 - 278, 2001-07-08 | |
| Highly Reliable Flip Chip on Flex Package using Multi-layered Anisotropic Conductive Film Yim, MJ; Hwang, JS; Kim, JG; Ahn, JY; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2002, pp.0 - 0, 2002-12 | |
| Novel epoxy/BaTiO3 composite embedded capacitor films embedded in organic substrates Paik, Kyung-Wook; Cho, S; Hyun, JG, Proceedings of 2004 International IEEE Conference on Asian Green Electronics (AGEC), pp.68 - 73, 2004-01-05 | |
| Flip Chip Assembly on Board using Anisotropic Conductive Adhesive/Film and Nickel-Gold Bump Paik, Kyung-Wook, Advances in Electronic Packaging, pp.367 - 372, 1999-06-01 |
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