Browse "MS-Conference Papers(학술회의논문)" by Author Zhang, Shuye
Showing results 1 to 9 of 9
| A study on the high frequency performance of solder ACFs joints for flex-on-board applications using coplanar waveguide Zhang, Shuye; Lin, Tiesong; He, Peng; Park, Junyong; Park, Gap Yeol; Song, Huijin; Kim, Joungho; et al, 68th IEEE Electronic Components and Technology Conference, ECTC 2018, pp.2404 - 2409, Institute of Electrical and Electronics Engineers Inc., 2018-05 |
| A Study on the Oxygen Plasma Treatment on the Peel Adhesion Strength and Solder Wettability of SnBi58 based Anisotropic Conductive Films Zhang, Shuye; Huang, Mingliang; Wu, Yang; Yang, Ming; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.2022 - 2028, IEEE, 2019-05 |
| A Study on the Preparation and Properties of Conductive Adhesive Filled with Multi-component Fillers for Green Packaging Zhang, Shuye; Yang, Ming; Zhang, Yanxin; Wang, Qian; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, 20th International Conference on Electronic Materials and Packaging (EMAP), IEEE, 2018-12 |
| Effects of Conductive Particles on the Power Handling Capability of ACFs Interconnection for Flex-On-Board Applications Zhang, Shuye; Park, Jae Hyeong; Paik, Kyung Wook, 15th International Symposium on Microelectronics and Packaging (ISMP 2016), The Korean Microelectronics and Packaging Society, 2016-10-25 |
| Effects of Cooling Processes and Silica Filler Contents of Solder ACFs (Anisotropic Conductive Films) on the Joints Reliability Zhang, Shuye; Paik, Kyung Wook, IEEE 66th Electronic Components and Technology Conference, pp.737 - 742, IEEE 66th Electronic Components and Technology Conference, 2016-06-02 |
| Effects of Polymer Rebound on Crack-Free Acrylic based SnBi58 ACFs (Anisotropic Conductive Films) Joints during a Thermal-Compression Bonding Method Zhang, Shuye; Paik, Kyung-Wook, 2017 IEEE 67th Electronic Components and Technology Conference, IEEE-CPMT, 2017-05-31 |
| Effects of the citrate-coated nanosized Ag pastes on joining reliable Cu-Cu joints for Current 3D ICs Zhang, Shuye; Duan, Xiaokang; Li, Zhenfeng; Xu, Jiaohao; Wang, Dayin; Zhang, Shang; He, Peng; et al, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), pp.1957 - 1962, IEEE, 2021-06 |
| Reliability analysis of 3D CSP MEMS and IC under thermal cycle-impact coupled multi-physics loads Zhang, Shuye; Xu, Jianhao; Zhang, Shang; He, Peng; Sun, Mingjia; Yang, Jianqun; Li, Xingji; et al, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), IEEE, 2021-06 |
| The Effect of Polymer Rebound on SnBi58 Solder ACFs Joints Cracks during a Thermo-Compression Bonding Zhang, Shuye; Paik, Kyung-Wook, 67th IEEE Electronic Components and Technology Conference, ECTC 2017, pp.2047 - 2053, Institute of Electrical and Electronics Engineers Inc., 2017-05 |
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