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Effect of the Cu thickness on the stability of a Ni/Cu bilayer UBM of lead free microbumps during liquid and solid state aging

Jurenka, C; Kim, JY; Wolf, MJ; Engelmann, G; Ehrmann, O; Yu, Jin; Reichl, H, 55th Electronic Components and Technology Conference, ECTC 2005, v.1, pp.89 - 93, 2005-05-31

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