DSpace at KOASAS
Browsing DSpace

Browse "MS-Conference Papers(학술회의논문)" by Author Wolf, J

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 1 to 6 of 6

1
Effects of Variation of Cu UBM Thickness in Electrodeposited Pure Tin Solder Microbumps

Yu, Jin; Kim, JY; Jurenka, C; Wolf, J; Engelmann, G; Herbert Reichl, EMAP 2004 Proceedings, pp.373 - 378, 2004

2
Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder

Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Reichl, H; Paik, Kyung-Wook, 51st Electronic Components and Technology Conference, pp.950 - 956, Electronic Components and Technology Conference, 2001-05-29

3
Multiple Flip-chip Assembly for Hybrid Compact Optoelectronic Modules using Electroplated AuSn Solder Bumps

Jeon, Duk Young; Chu, KM; Lee, JS; Oppermann, H; Engelmann, G; Wolf, J; Reichl, H, IMAPS 2006 (39th International Symposium on Microelectronics 2006), pp.653 -, 2006

4
Pd-Free Bumping Technology and UBM (Under Bump Metallurgy)

Jang, SY; Paik, Kyung-Wook; Wolf, J; Reichl, H, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2001, pp.121 - 128, 2001-11-01

5
Successive Multiple Flip-chip Assembly using Gold-tin Solder Bump for a Compact Optoelectronic Module

Jeon, Duk Young; Chu, KM; Lee, JS; Oppermann, H; Engelmann, G; Wolf, J; Reichl, H, 2006 Microoptics Conference (The Joint International Conference on Plastic Optical Fiber and Microoptics 2006), pp.78 -, 2006

6
UBM (Under Bump Metallization) study for Pb-free electroplating bumping: Interface reaction and electromigration

Jang, SY; Wolf, J; Kwon, WS; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.1213 - 1220, IEEE, 2002-05-28

Discover

rss_1.0 rss_2.0 atom_1.0